Imager system comprising an integrated optical filter arranged between an imager and a transparent plate
    1.
    发明授权
    Imager system comprising an integrated optical filter arranged between an imager and a transparent plate 有权
    成像系统包括布置在成像器和透明板之间的集成滤光器

    公开(公告)号:US07851826B2

    公开(公告)日:2010-12-14

    申请号:US11779171

    申请日:2007-07-17

    IPC分类号: H01L27/00

    摘要: A method manufactures semiconductor chips each comprising a component implanted in the semiconductor. The method includes collectively implanting components onto a front face of a semiconductor wafer and fixing the a plate of a transparent material onto the front face of the wafer. Fixing the plate of transparent material is preceded by a step of depositing, on the front face of the wafer, at least one layer of polymer material forming an optical filter. Application is particularly to the manufacturing of imagers.

    摘要翻译: 一种制造半导体芯片的方法,每个半导体芯片包括注入在半导体中的元件。 该方法包括将组件一起植入半导体晶片的正面,并将透明材料的板固定在晶片的正面上。 固定透明材料的板之前是在晶片的正面上沉积形成滤光器的至少一层聚合物材料的步骤。 应用特别是制造成像器。

    MOSFET transistor with short channel effect compensated by the gate material
    3.
    发明授权
    MOSFET transistor with short channel effect compensated by the gate material 有权
    具有沟道效应的MOSFET晶体管由栅极材料补偿

    公开(公告)号:US06528399B1

    公开(公告)日:2003-03-04

    申请号:US09606600

    申请日:2000-06-29

    IPC分类号: H01L2122

    CPC分类号: H01L29/4983 H01L21/28105

    摘要: A MOSFET transistor comprising a gate made of silicon-germanium alloy, formed on a single crystal silicon substrate by means of a thin insulating layer, and drain and source regions implanted in the substrate on each side of the gate, characterized in that the gate comprises side regions presenting an increasing germanium percentage towards the sides of the gate facing the drain and source regions. Advantage: compensation of the short channel effect by locally decreasing the work function of the gate material near the drain and source regions.

    摘要翻译: 一种MOSFET晶体管,包括由硅 - 锗合金构成的栅极,其通过薄绝缘层在单晶硅衬底上形成,并且漏极和源极区域注入到栅极的每一侧上的衬底中,其特征在于栅极包括 侧面区域朝着面向漏极和源极区域的栅极的侧面呈现增加的锗百分比。 优点:通过局部降低漏极和源极区附近栅极材料的功函来补偿短沟道效应。

    METHOD OF MANUFACTURING A SEMICONDUCTOR WAFER COMPRISING AN INTEGRATED OPTICAL FILTER
    5.
    发明申请
    METHOD OF MANUFACTURING A SEMICONDUCTOR WAFER COMPRISING AN INTEGRATED OPTICAL FILTER 有权
    制造包含一体化光学滤波器的半导体滤波器的方法

    公开(公告)号:US20080023739A1

    公开(公告)日:2008-01-31

    申请号:US11779171

    申请日:2007-07-17

    IPC分类号: H01L21/00 H01L31/062

    摘要: A method manufactures semiconductor chips each comprising a component implanted in the semiconductor. The method includes collectively implanting components onto a front face of a semiconductor wafer and fixing a plate of a transparent material onto the front face of the wafer. Fixing the plate of transparent material is preceded by a step of depositing, on the front face of the wafer, at least one layer of polymer material forming an optical filter. Application is particularly to the manufacturing of imagers.

    摘要翻译: 一种制造半导体芯片的方法,每个半导体芯片包括注入在半导体中的元件。 该方法包括将组件一起植入半导体晶片的正面并将透明材料的板固定在晶片的前表面上。 固定透明材料的板之前是在晶片的正面上沉积形成滤光器的至少一层聚合物材料的步骤。 应用特别是制造成像器。

    Method and device for treating a surface
    6.
    发明授权
    Method and device for treating a surface 有权
    用于处理表面的方法和装置

    公开(公告)号:US08975557B2

    公开(公告)日:2015-03-10

    申请号:US13062657

    申请日:2009-09-07

    摘要: A method for treating a surface is disclosed. According to some aspects, the method includes ejecting matter from the surface by projecting an ejection agent on the surface. The ejection agent is selected from gases, fluids in supercritical state, solid materials in divided form, solid materials in a gas vector and electromagnetic radiation. The method includes trapping the ejected matter in one or several pieces of an aerogel situated on trajector of the ejected matter. A device for carrying out this method as well as the use of an aerogel to trap the matter ejected from a surface during a treatment of that surface are also disclosed. The method may be applied in fields including cleaning, satinizing, polishing, deburring, etching, marking, pre-adhesion surface preparation metallization enameling, painting or varnishing operations are done, in particular electronics, microelectronics, optics, optoelectronics, bijouterie, jewelry, and the restoration of art and antiques.

    摘要翻译: 公开了一种处理表面的方法。 根据一些方面,该方法包括通过将喷射剂投射在表面上从表面喷出物质。 喷射剂选自气体,超临界状态的液体,分散形式的固体物质,气体载体中的固体物质和电磁辐射。 该方法包括将排出的物质捕获在位于所述喷射物质的轨迹上的一个​​或多个气凝胶中。 还公开了一种用于实施该方法的装置以及在该表面的处理期间使用气凝胶来捕获从表面喷出的物质。 该方法可以应用于包括清洁,缎纹,抛光,去毛刺,蚀刻,标记,预附着表面准备金属化搪瓷,涂漆或上漆操作的领域,特别是电子,微电子,光学,光电子学,珠宝和珠宝 恢复艺术和古董。

    Method for manufacturing lenses, in particular for CMOS imager
    7.
    发明授权
    Method for manufacturing lenses, in particular for CMOS imager 有权
    用于制造透镜的方法,特别是用于CMOS成像器

    公开(公告)号:US07919022B2

    公开(公告)日:2011-04-05

    申请号:US11752187

    申请日:2007-05-22

    IPC分类号: B29C11/00

    摘要: A method manufactures a digital image sensor including at least one optical lens using a hardenable liquid or gelatinous material. The method includes depositing a calibrated volume of the material on a lens formation base using a tubular needle of a small diameter, so that the volume of material deposited has at least one convex part under the effect of interface energies, and hardening all or part of the volume of deposited material.

    摘要翻译: 一种制造数字图像传感器的方法,该数字图像传感器包括使用可硬化液体或凝胶状材料的至少一个光学透镜。 该方法包括使用小直径的管状针将材料的校准体积沉积在透镜形成基底上,使得沉积的材料的体积在界面能量的作用下具有至少一个凸起部分,并且硬化全部或部分 沉积物的体积。

    Method of manufacturing a semiconductor wafer comprising an integrated optical filter
    8.
    发明授权
    Method of manufacturing a semiconductor wafer comprising an integrated optical filter 有权
    包括集成滤光器的半导体晶片的制造方法

    公开(公告)号:US08329498B2

    公开(公告)日:2012-12-11

    申请号:US12916363

    申请日:2010-10-29

    IPC分类号: H01L21/00

    摘要: A method manufactures semiconductor chips each comprising a component implanted in the semiconductor. The method includes collectively implanting components onto a front face of a semiconductor wafer and fixing a plate of a transparent material onto the front face of the wafer. Fixing the plate of transparent material is preceded by a step of depositing, on the front face of the wafer, at least one layer of polymer material forming an optical filter. Application is particularly to the manufacturing of imagers.

    摘要翻译: 一种制造半导体芯片的方法,每个半导体芯片包括注入在半导体中的元件。 该方法包括将组件一起植入半导体晶片的正面并将透明材料的板固定在晶片的前表面上。 固定透明材料的板之前是在晶片的正面上沉积形成滤光器的至少一层聚合物材料的步骤。 应用特别是制造成像器。

    METHOD AND DEVICE FOR TREATING A SURFACE
    9.
    发明申请
    METHOD AND DEVICE FOR TREATING A SURFACE 有权
    用于处理表面的方法和装置

    公开(公告)号:US20110215075A1

    公开(公告)日:2011-09-08

    申请号:US13062657

    申请日:2009-09-07

    IPC分类号: B23K26/00

    摘要: A method for treating a surface is disclosed. According to some aspects, the method includes ejecting matter from the surface by projecting an ejection agent on the surface. The ejection agent is selected from gases, fluids in supercritical state, solid materials in divided form,. solid materials in a as vector and electromagnetic radiation. The method includes trapping the ejected matter in one or several pieces of an aerogel situated on trajector of the ejected matter. A device for car in out this method as well as the use of an aerogel to trap the matter ejected from a surface during a treatment of that surface are also disclosed. The method may be applied in fields including cleaning, satinizing, polishing, deburring, etching, marking, pre-adhesion surface preparation metallization enameling, painting or varnishing operations are done, in particular electronics, microelectronics, optics, optoelectronics, bijouterie, jewelry, and the restoration of art and antiques.

    摘要翻译: 公开了一种处理表面的方法。 根据一些方面,该方法包括通过将喷射剂投射在表面上从表面喷出物质。 喷射剂选自气体,超临界状态的液体,分散形式的固体物质。 固体材料作为载体和电磁辐射。 该方法包括将排出的物质捕获在位于所述喷射物质的轨迹上的一个​​或多个气凝胶中。 还公开了一种用于该方法的装置以及在该表面的处理期间使用气凝胶来捕获从表面喷射的物质。 该方法可以应用于包括清洁,缎纹,抛光,去毛刺,蚀刻,标记,预附着表面准备金属化搪瓷,涂漆或上漆操作的领域,特别是电子,微电子学,光学,光电子学,珠宝首饰和 恢复艺术和古董。

    METHOD FOR PROCESSING A SCRATCHED SURFACE, PARTICULARLY A GLASS PLATE OF A SEMICONDUCTOR WAFER
    10.
    发明申请
    METHOD FOR PROCESSING A SCRATCHED SURFACE, PARTICULARLY A GLASS PLATE OF A SEMICONDUCTOR WAFER 审中-公开
    用于处理切割表面的方法,特别是半导体波形的玻璃板

    公开(公告)号:US20070290244A1

    公开(公告)日:2007-12-20

    申请号:US11753264

    申请日:2007-05-24

    摘要: A method for processing a scratched surface of a material that is transparent to electromagnetic radiation includes a step of depositing onto the scratched surface at least one layer of a polymer material having substantially the same optical index as the material having the scratched surface, so as to fill in the scratches, and a step of polymerizing the polymer material. The method may be applied to the manufacture of semiconductor wafers including imagers.

    摘要翻译: 用于处理对电磁辐射透明的材料的划伤表面的方法包括在刮擦表面上沉积至少一层具有与具有划伤表面的材料具有基本相同的光学折射率的聚合物材料的步骤,以便 填充划痕,以及使聚合物材料聚合的步骤。 该方法可以应用于包括成像器的半导体晶片的制造。