Invention Application
US20070292667A1 Molded polymer comprising silicone and at least one metal trace and a process of manufacturing the same 有权
包含有机硅和至少一种金属痕迹的成型聚合物及其制造方法

  • Patent Title: Molded polymer comprising silicone and at least one metal trace and a process of manufacturing the same
  • Patent Title (中): 包含有机硅和至少一种金属痕迹的成型聚合物及其制造方法
  • Application No.: US11810758
    Application Date: 2007-06-06
  • Publication No.: US20070292667A1
    Publication Date: 2007-12-20
  • Inventor: Lucien LaudeRobert Greenberg
  • Applicant: Lucien LaudeRobert Greenberg
  • Main IPC: B32B3/00
  • IPC: B32B3/00
Molded polymer comprising silicone and at least one metal trace and a process of manufacturing the same
Abstract:
The present invention provides a flexible electrode array, comprising a silicone containing body, at least one metal trace layer and at least one electrode pad on the surface. The present invention further provides a process of manufacturing a flexible electrode array, comprising: a) irradiating a surface area of a molded silicone containing layer yielding traces with a light beam emitted by a pulsed UV laser source, b) immersing said irradiated molded silicone layer for inducing the deposit of metal ions to form metal traces, c) applying a silicone containing layer on said silicone containing layer and said metal traces, d) irradiating the surface for drilling holes into the surface of the molded silicone containing layer, and e) immersing said irradiated molded silicone layer for inducing the deposit of metal ions to form metal electrode pads.
Public/Granted literature
Information query
Patent Agency Ranking
0/0