发明申请
US20070295528A1 Pb-free Sn-based material, wiring conductor, terminal connecting assembly, and Pb-free solder alloy
审中-公开
无铅锡基材料，布线导体，端子连接组件和无铅焊料合金
- 专利标题： Pb-free Sn-based material, wiring conductor, terminal connecting assembly, and Pb-free solder alloy
- 专利标题（中）： 无铅锡基材料，布线导体，端子连接组件和无铅焊料合金
-
申请号： US11806788申请日： 2007-06-04
-
公开(公告)号： US20070295528A1公开(公告)日： 2007-12-27
- 发明人: Hajime Nishi , Takayuki Tsuji , Hiroshi Yamanobe , Hiroshi Okikawa
- 申请人： Hajime Nishi , Takayuki Tsuji , Hiroshi Yamanobe , Hiroshi Okikawa
- 申请人地址： JP Tokyo
- 专利权人： HITACHI CABLE, LTD.
- 当前专利权人： HITACHI CABLE, LTD.
- 当前专利权人地址： JP Tokyo
- 优先权： JP2006-175279 20060626; JP2007-045927 20070226
- 主分类号： H01B7/00
- IPC分类号： H01B7/00 ; B23P19/04 ; C22C13/00 ; C22C13/02
摘要：
A Pb-free Sn-based material part of a wiring conductor is provided at least at a part of a surface the wiring conductor, and the Sn-based material part includes a base metal doped with a transformation retardant element and an oxidation control element. The transformation retardant element is at least one element selected from a group consisted of Sb, Bi, Cd, In, Ag, Au, Ni, Ti, Zr, and Hf. The oxidation control element is at least one element selected from a group consisted of Ge, P, Zn, Kr, Cr, Mn, Na, V, Si, Al, Li, Mg and Ca. The wiring conductor is reflow processed, such that at least one of the Sn, the transformation retardant element and the oxidation control element is diffused to form an alloy.
信息查询
