发明申请
- 专利标题: Semiconductor Device and Manufacturing Method Thereof
- 专利标题(中): 半导体器件及其制造方法
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申请号: US11579141申请日: 2005-05-16
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公开(公告)号: US20080001148A1公开(公告)日: 2008-01-03
- 发明人: Kazuo Nishi , Junya Maruyama , Naoto Kusumoto , Yuusuke Sugawara
- 申请人: Kazuo Nishi , Junya Maruyama , Naoto Kusumoto , Yuusuke Sugawara
- 优先权: JP2004-152160 20040521
- 国际申请: PCT/JP05/09285 WO 20050516
- 主分类号: H01L31/02
- IPC分类号: H01L31/02 ; H01L21/30 ; H01L31/04
摘要:
An object of the present invention to provide a semiconductor device manufactured in short time by performing the step of forming the thin film transistor and the step of forming the photoelectric conversion layer in parallel, and to provide a manufacturing process thereof. According to the present invention, a semiconductor device is manufactured in such a way that a thin film transistor is formed over a first substrate, a photoelectric conversion element is formed over a second substrate, and the thin film transistor and the photoelectric conversion element are connected electrically by sandwiching a conductive layer between the first and second substrates opposed to each other so that the thin film transistor and the photoelectric conversion element are located between the first and second substrates. Thus, a method for manufacturing a semiconductor device which suppresses the increase in the number of steps and which increases the throughput can be provided.
公开/授权文献
- US07691686B2 Semiconductor device and manufacturing method thereof 公开/授权日:2010-04-06
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