发明申请
- 专利标题: Earthing Device Which Needs Not Be Buried Under Ground
- 专利标题(中): 接地装置不需要埋在地下
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申请号: US11587413申请日: 2006-07-24
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公开(公告)号: US20080002327A1公开(公告)日: 2008-01-03
- 发明人: Jea Woo , Jin Huh , Seungjoon Ahn , Seong Ahn , Chul Geun Park , Ho Sub Son , Jin Seok Jin , Hyung Gu Jeon
- 申请人: Jea Woo , Jin Huh , Seungjoon Ahn , Seong Ahn , Chul Geun Park , Ho Sub Son , Jin Seok Jin , Hyung Gu Jeon
- 申请人地址: KR SEONGNAM-SI, GYEONGGI-DO 462-725
- 专利权人: GROUND CO., LTD.
- 当前专利权人: GROUND CO., LTD.
- 当前专利权人地址: KR SEONGNAM-SI, GYEONGGI-DO 462-725
- 优先权: KR10-2006-0030163 20060403
- 国际申请: PCT/KR06/02907 WO 20060724
- 主分类号: H05F3/02
- IPC分类号: H05F3/02
摘要:
An earthing device which needs not be buried under the ground is provided. The earthing device includes an earthing panel and a discharging device mounted inside the earthing panel. The discharging device includes at least one electrode plate, multiple discharging electrodes coupled to the electrode plate, and catalyst filled between the discharging electrodes. Since an earth electrode needs not be buried under the ground, it requires less construction costs, time and area, and environmental pollution (especially, soil pollution) does not happen. Further, the earthing device can be simply and economically installed regardless of place.
公开/授权文献
- US07652865B2 Earthing device which needs not be buried under ground 公开/授权日:2010-01-26
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