Invention Application
- Patent Title: LARGE AREA, UNIFORMLY LOW DISLOCATION DENSITY GAN SUBSTRATE AND PROCESS FOR MAKING THE SAME
- Patent Title (中): 大面积,均匀的低偏差密度基体及其制造方法
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Application No.: US11856222Application Date: 2007-09-17
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Publication No.: US20080003786A1Publication Date: 2008-01-03
- Inventor: Xueping Xu , Robert Vaudo
- Applicant: Xueping Xu , Robert Vaudo
- Applicant Address: US NC Durham 27703
- Assignee: CREE, INC.
- Current Assignee: CREE, INC.
- Current Assignee Address: US NC Durham 27703
- Main IPC: H01L21/20
- IPC: H01L21/20 ; C30B23/00 ; C30B25/00 ; C30B28/12 ; C30B28/14

Abstract:
Large area, uniformly low dislocation density single crystal Ill-V nitride material, e.g., gallium nitride having a large area of greater than 15 cm2, a thickness of at least 1 mm, an average dislocation density not exceeding 5E5 cm−2, and a dislocation density standard deviation ratio of less than 25%, and methods of forming same, are disclosed. Such material can be formed on a substrate by a process including (i) a first phase of growing the Ill-V nitride material on the substrate under pitted growth conditions, e.g., forming pits over at least 50% of the growth surface of the III-V nitride material, wherein the pit density on the growth surface is at least 102 pits/cm2 of the growth surface, and (ii) a second phase of growing the III-V nitride material under pit-filling conditions.
Public/Granted literature
- US07879147B2 Large area, uniformly low dislocation density GaN substrate and process for making the same Public/Granted day:2011-02-01
Information query
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