发明申请
- 专利标题： METHOD FOR INCREASING THE PLANARITY OF A SURFACE TOPOGRAPHY IN A MICROSTRUCTURE
- 专利标题（中）： 在微结构中增加表面形貌平面的方法
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申请号： US11674869申请日： 2007-02-14
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公开(公告)号： US20080003826A1公开(公告)日： 2008-01-03
- 发明人: Thomas Werner , Robert Seidel , Frank Feustel
- 申请人： Thomas Werner , Robert Seidel , Frank Feustel
- 优先权： DE2006030265.6 20060630
- 主分类号： H01L21/302
- IPC分类号： H01L21/302
摘要：
By additionally planarizing the surface topography of a planarization layer, which may be accomplished on the basis of mechanical contact, a uniform force, a polishing process and the like, an enhanced surface topography may be provided which may be advantageously used in subsequent patterning processes, such as photolithography, imprint techniques and the like.
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