发明申请
US20080006605A1 Method of Manufacturing a Porous Resin Substrate Having Perforations and Method of Making a Porous Resin Substrate Including Perforations Having Electrically Conductive Wall Faces 失效
具有穿孔的多孔树脂基板的制造方法以及制造具有导电壁面的穿孔的多孔树脂基板的方法

Method of Manufacturing a Porous Resin Substrate Having Perforations and Method of Making a Porous Resin Substrate Including Perforations Having Electrically Conductive Wall Faces
摘要:
A method of manufacturing a perforated porous resin substrate, the method including the following steps: Step 1 of forming at least one perforation penetrating in the thickness direction from a first surface to a second surface in a porous resin substrate made of a resin material containing a fluoropolymer; Step 2 of etching treatment conducted by putting an etchant containing an alkali metal in contact with the wall face of each perforation; and Step 3 of putting an oxidizable compound or a solution thereof in contact with a degenerative layer generated by the etching treatment, and thereby removing the degenerative layer. A method of manufacturing a porous resin substrate in which electrical conductivity is afforded to the wall face of the perforation.
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