发明申请
- 专利标题： SEMICONDUCTOR COMPONENT AND METHOD FOR PRODUCING THE SAME
- 专利标题（中）： 半导体元件及其制造方法
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申请号： US11778887申请日： 2007-07-17
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公开(公告)号： US20080012119A1公开(公告)日： 2008-01-17
- 发明人: Ralf Otremba , Josef Hoeglauer , Matthias Stecher
- 申请人： Ralf Otremba , Josef Hoeglauer , Matthias Stecher
- 申请人地址： DE Neubiberg
- 专利权人： Infineon Technologies AG
- 当前专利权人： Infineon Technologies AG
- 当前专利权人地址： DE Neubiberg
- 优先权： DE102006033319.5 20060717
- 主分类号： H01L23/04
- IPC分类号： H01L23/04 ; H01L23/48
摘要：
A semiconductor component of semiconductor chip size includes a semiconductor chip. The semiconductor chip has a metallic coating that completely covers the edge sides and the rear side and partly covers the top side, on which surface-mountable external contacts are arranged. One aspect includes power semiconductor components, wherein the metallic coating connects a rear side electrode to one of the surface-mountable external contacts on the top side of a power semiconductor chip.
公开/授权文献
- US07528010B2 Semiconductor component and method for producing the same 公开/授权日：2009-05-05
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