发明申请
US20080013634A1 APPARATUS AND METHOD FOR HIGH-SPEED INTERFACING BETWEEN INTEGRATED CIRCUITS
审中-公开
集成电路之间高速接口的设备和方法
- 专利标题： APPARATUS AND METHOD FOR HIGH-SPEED INTERFACING BETWEEN INTEGRATED CIRCUITS
- 专利标题（中）： 集成电路之间高速接口的设备和方法
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申请号： US11774747申请日： 2007-07-09
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公开(公告)号： US20080013634A1公开(公告)日： 2008-01-17
- 发明人: Jin-Seok LEE , Song-Hun Kim , Kwang-Yung Jeong , Min-Soo Jung , Soon-Ju Kim
- 申请人： Jin-Seok LEE , Song-Hun Kim , Kwang-Yung Jeong , Min-Soo Jung , Soon-Ju Kim
- 申请人地址： KR Suwon-city
- 专利权人： Samsung Electronics Co., LTD.
- 当前专利权人： Samsung Electronics Co., LTD.
- 当前专利权人地址： KR Suwon-city
- 优先权： KR2006-0066291 20060714
- 主分类号： H04L27/00
- IPC分类号： H04L27/00
摘要：
An apparatus and method for high-speed interfacing between ICs are provided. A generator generates space clock pulses by adjusting a data rate of data. An inserter inserts commas during the space clock pulses. And a transmitter transmits bit streams with the data and the commas to a receiving IC. Accordingly, data can be transmitted and received at high rates between ICs.
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