发明申请
- 专利标题: TEMPERATURE UNIFORMITY MEASUREMENTS DURING RAPID THERMAL PROCESSING
- 专利标题(中): 在快速热处理期间的温度均匀度测量
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申请号: US11830845申请日: 2007-07-30
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公开(公告)号: US20080025368A1公开(公告)日: 2008-01-31
- 发明人: WOLFGANG ADERHOLD , Andreas Hegedus , Nir Merry
- 申请人: WOLFGANG ADERHOLD , Andreas Hegedus , Nir Merry
- 主分类号: G01J5/00
- IPC分类号: G01J5/00
摘要:
Methods and apparatus for measuring substrate uniformity is provided. The invention includes placing a substrate in a thermal processing chamber, rotating the substrate while the substrate is heated, measuring a temperature of the substrate at a plurality of radial locations as the substrate rotates, correlating each temperature measurement with a location on the substrate, and generating a temperature contour map for the substrate based on the correlated temperature measurements. Numerous other aspects are provided.