Invention Application
- Patent Title: MULTI-LAYERED COMPLEMENTARY CONDUCTIVE LINE STRUCTURE
- Patent Title (中): 多层补充导电线结构
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Application No.: US11870426Application Date: 2007-10-11
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Publication No.: US20080029902A1Publication Date: 2008-02-07
- Inventor: Yu-Cheng Chen , Chi-Lin Chen , Chi-Ming Chang
- Applicant: Yu-Cheng Chen , Chi-Lin Chen , Chi-Ming Chang
- Applicant Address: TW Hsinchu
- Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Current Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Current Assignee Address: TW Hsinchu
- Priority: TW94124655 20050721
- Main IPC: H01L23/52
- IPC: H01L23/52
Abstract:
A multi-layered complementary conductive line structure, a manufacturing method thereof and a manufacturing method of a TFT (thin film transistor) display array are provided. The process of TFT having multi-layered complementary conductive line structures does not need to increase the mask number in comparison with the currently process and is able to solve the resistance problem of the lines inside a display.
Public/Granted literature
- US07960731B2 Multi-layered complementary conductive line structure Public/Granted day:2011-06-14
Information query
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