Embodiments of the invention provide memory module having an improved arrangement of discrete devices. In one embodiment, the invention provides a memory module comprising a board; a plurality of tabs disposed adjacent to a first edge of the board and disposed on a first surface of the board; and a memory pad region disposed on the first surface and comprising memory chip pads, wherein each memory chip pad is electrically connected to at least one of the tabs. The memory module further comprises discrete devices corresponding to the memory pad region, wherein the discrete devices corresponding to the memory pad region are disposed on only one side of the memory pad region. In the memory module, each of the discrete devices is electrically connected to at least one of the tabs and at least one of the memory chip pads.