MEMORY SYSTEM AND METHOD FOR PREVENTING SYSTEM HANG
    1.
    发明申请
    MEMORY SYSTEM AND METHOD FOR PREVENTING SYSTEM HANG 有权
    用于防止系统的记忆系统和方法

    公开(公告)号:US20110219274A1

    公开(公告)日:2011-09-08

    申请号:US12966171

    申请日:2010-12-13

    IPC分类号: G06F11/00

    CPC分类号: G06F11/00

    摘要: A memory system includes an error detection circuit having an error counter. When a bit error rate (BER) determined by the error counter exceeds a reference BER, the memory system reduces the BER by adjusting its operating speed or operating voltage, re-performing data training or impedance matching, or by adjusting a data swing width. Accordingly, a method of controlling a bit error rate may be performed, and a system hang is prevented.

    摘要翻译: 存储器系统包括具有错误计数器的错误检测电路。 当由错误计数器确定的误码率(BER)超过参考BER时,存储器系统通过调整其运行速度或工作电压,重新执行数据训练或阻抗匹配或调整数据摆幅宽度来降低BER。 因此,可以执行控制误码率的方法,并且防止系统挂起。

    MEMORY MODULE AND MEMORY SYSTEM COMPRISING MEMORY MODULE
    2.
    发明申请
    MEMORY MODULE AND MEMORY SYSTEM COMPRISING MEMORY MODULE 有权
    包含存储器模块的存储器模块和存储器系统

    公开(公告)号:US20110161576A1

    公开(公告)日:2011-06-30

    申请号:US12897189

    申请日:2010-10-04

    IPC分类号: G06F12/00 G06F3/00

    摘要: A memory module comprises a plurality of semiconductor memory devices each having a termination circuit for a command/address bus. The semiconductor memory devices are formed in a substrate of the memory module, and they operate in response to a command/address signal, a data signal, and a termination resistance control signal.

    摘要翻译: 存储器模块包括多个半导体存储器件,每个半导体存储器件具有用于命令/地址总线的终端电路。 半导体存储器件形成在存储器模块的衬底中,并且它们响应于命令/地址信号,数据信号和终端电阻控制信号而工作。

    MEMORY MODULE, MEMORY MODULE SOCKET AND MAINBOARD USING SAME
    5.
    发明申请
    MEMORY MODULE, MEMORY MODULE SOCKET AND MAINBOARD USING SAME 有权
    存储模块,存储模块插座和使用相同的主板

    公开(公告)号:US20080038961A1

    公开(公告)日:2008-02-14

    申请号:US11836286

    申请日:2007-08-09

    IPC分类号: H01R24/00

    摘要: A memory module socket disposed on a principal surface of a mainboard, and adapted to mechanically receive and electrically connect a memory module with a mainboard, the memory module socket including a first unit socket having a plurality of first socket pins adapted to electrically connect a first connector disposed on an edge of the memory module, and a second unit socket having a plurality of second socket pins adapted to electrically connect to a second connector disposed on the memory module orthogonal to the first connector, wherein the memory module as installed in the memory module socket is parallel to the principal surface of the mainboard.

    摘要翻译: 存储模块插座,设置在主板的主表面上,并且适于机械地接收和电连接存储器模块与主板,所述存储器模块插座包括第一单元插座,所述第一单元插座具有多个第一插座引脚,所述第一插座引脚适于电连接第一 连接器,其设置在存储器模块的边缘上,以及第二单元插座,其具有多个第二插座引脚,其适于电连接到设置在与第一连接器正交的存储器模块上的第二连接器,其中存储器模块安装在存储器 模块插座平行于主板的主表面。

    Memory device with different termination units for different signal frequencies
    6.
    发明授权
    Memory device with different termination units for different signal frequencies 失效
    具有不同信号频率的不同终端单元的存储器件

    公开(公告)号:US07254066B2

    公开(公告)日:2007-08-07

    申请号:US10975808

    申请日:2004-10-27

    申请人: Jung-Joon Lee

    发明人: Jung-Joon Lee

    IPC分类号: G11C7/00 H03K17/16

    摘要: A memory device includes a first termination unit coupled to a first pin for receiving a first signal having a first frequency component. The memory device also includes a second termination unit coupled to a second pin for receiving a second signal having a second frequency component higher than the first frequency component. The first termination unit is a different type from the second termination unit that provides less signal distortion than the first termination unit. For example, the first termination unit is of an open-drain type that has less power consumption, and the second termination unit is of a push-pull type that has less signal distortion.

    摘要翻译: 存储器件包括耦合到第一引脚的第一终端单元,用于接收具有第一频率分量的第一信号。 存储器件还包括耦合到第二引脚的第二终端单元,用于接收具有高于第一频率分量的第二频率分量的第二信号。 第一终端单元是与第二终端单元不同的类型,其提供比第一终端单元更少的信号失真。 例如,第一终端单元是具有较少功耗的开漏型,并且第二终端单元是具有较小信号失真的推挽式。

    Memory module and method of mounting memory device on PCB for memory module
    8.
    发明申请
    Memory module and method of mounting memory device on PCB for memory module 有权
    存储器模块和将存储器件安装在PCB上用于存储器模块的方法

    公开(公告)号:US20060125071A1

    公开(公告)日:2006-06-15

    申请号:US11301142

    申请日:2005-12-12

    IPC分类号: H01L23/02

    摘要: A memory module and a method of mounting memory devices on a PCB to form the memory module substantially reduce unnecessary routing space and improve signal attenuation characteristics. In the method of mounting and sequentially connecting at least two memory devices on a printed circuit board(PCB) having an axis of elongation to form a memory module, at least one of the memory devices is mounted on at least one face of the PCB so that a base line along an longitudinal axis of the at least one memory device lies at an acute angle with respect to the axis of elongation of the PCB.

    摘要翻译: 存储器模块和将存储器件安装在PCB上以形成存储器模块的方法基本上减少不必要的路由空间并改善信号衰减特性。 在将具有延伸轴的印刷电路板(PCB)上的至少两个存储器件安装并顺序地连接以形成存储器模块的方法中,至少一个存储器件安装在PCB的至少一个面上, 沿着至少一个存储器装置的纵向轴线的基线相对于PCB的伸长轴线成锐角。