Invention Application
US20080030969A1 Method for manufacturing a printed circuit board with a thin film capacitor embedded therein having a dielectric film by using laser lift-off, and printed circuit board with a thin film capacitor embedded therein manufactured thereby 有权
制造具有通过使用激光剥离的具有电介质膜的薄膜电容器的印刷电路板的制造方法以及由此制造的具有嵌入其中的薄膜电容器的印刷电路板

  • Patent Title: Method for manufacturing a printed circuit board with a thin film capacitor embedded therein having a dielectric film by using laser lift-off, and printed circuit board with a thin film capacitor embedded therein manufactured thereby
  • Patent Title (中): 制造具有通过使用激光剥离的具有电介质膜的薄膜电容器的印刷电路板的制造方法以及由此制造的具有嵌入其中的薄膜电容器的印刷电路板
  • Application No.: US11808298
    Application Date: 2007-06-08
  • Publication No.: US20080030969A1
    Publication Date: 2008-02-07
  • Inventor: Jung LeeYul ChungIn Hyung Lee
  • Applicant: Jung LeeYul ChungIn Hyung Lee
  • Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
  • Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
  • Priority: KR10-2006-0067188 20060719
  • Main IPC: H05K7/02
  • IPC: H05K7/02 H01L21/62
Method for manufacturing a printed circuit board with a thin film capacitor embedded therein having a dielectric film by using laser lift-off, and printed circuit board with a thin film capacitor embedded therein manufactured thereby
Abstract:
A method for manufacturing a printed circuit board with a capacitor embedded therein which has a dielectric film using laser lift off, and a capacitor manufactured thereby. In the method, a dielectric film is formed on a transparent substrate and heat-treated. A first conductive layer is formed on the heat-treated dielectric film. A laser beam is irradiated onto a stack formed, from below the transparent substrate, to separate the transparent substrate from the stack. After the transparent substrate is separated from the stack, a second conductive layer is formed with a predetermined pattern on the dielectric film. Also, an insulating layer and a third conductive layer are formed on the first and second conductive layers to alternate with each other in a predetermined number.
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