Invention Application
- Patent Title: Post-deposition encapsulation of nanostructures: compositions, devices and systems incorporating same
- Patent Title (中): 纳米结构的沉积后包封：组合物，包含其的装置和系统
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Application No.: US11706730Application Date: 2007-02-13
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Publication No.: US20080032134A1Publication Date: 2008-02-07
- Inventor: Jeffery Whiteford , Rhett Brewer , Mihai Buretea , Jian Chen , Karen Cruden , Xiangfeng Duan , William Freeman , David Heald , Francisco Leon , Chao Liu , Andreas Meisel , Kyu Min , J. Parce , Erik Scher
- Applicant: Jeffery Whiteford , Rhett Brewer , Mihai Buretea , Jian Chen , Karen Cruden , Xiangfeng Duan , William Freeman , David Heald , Francisco Leon , Chao Liu , Andreas Meisel , Kyu Min , J. Parce , Erik Scher
- Applicant Address: US CA Palo Alto
- Assignee: NANOSYS, Inc.
- Current Assignee: NANOSYS, Inc.
- Current Assignee Address: US CA Palo Alto
- Main IPC: B32B5/16
- IPC: B32B5/16 ; B32B15/04 ; B32B17/06
Abstract:
Ligand compositions for use in preparing discrete coated nanostructures are provided, as well as the coated nanostructures themselves and devices incorporating same. Methods for post-deposition shell formation on a nanostructure and for reversibly modifying nanostructures are also provided. The ligands and coated nanostructures of the present invention are particularly useful for close packed nanostructure compositions, which can have improved quantum confinement and/or reduced cross-talk between nanostructures.
Public/Granted literature
- US07585564B2 Post-deposition encapsulation of nanostructures: compositions, devices and systems incorporating same Public/Granted day:2009-09-08
Information query
