Invention Application
US20080032988A1 Thieno-[2,3-d]pyrimidine and thieno-pyridazine compounds and methods of use
有权
噻吩并[2,3-d]嘧啶和噻吩并哒嗪化合物及其使用方法
- Patent Title: Thieno-[2,3-d]pyrimidine and thieno-pyridazine compounds and methods of use
- Patent Title (中): 噻吩并[2,3-d]嘧啶和噻吩并哒嗪化合物及其使用方法
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Application No.: US11789189Application Date: 2007-04-23
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Publication No.: US20080032988A1Publication Date: 2008-02-07
- Inventor: Fang-Tsao Hong , James Falsey , Robert Rzasa , Seifu Tadesse , Andrew Tasker
- Applicant: Fang-Tsao Hong , James Falsey , Robert Rzasa , Seifu Tadesse , Andrew Tasker
- Applicant Address: US CA Thousand Oaks
- Assignee: Amgen Inc.
- Current Assignee: Amgen Inc.
- Current Assignee Address: US CA Thousand Oaks
- Main IPC: A61K31/50
- IPC: A61K31/50 ; A61P19/02 ; C07D237/00
![Thieno-[2,3-d]pyrimidine and thieno-pyridazine compounds and methods of use](/abs-image/US/2008/02/07/US20080032988A1/abs.jpg.150x150.jpg)
Abstract:
The present invention comprises a new class of compounds useful for the prophylaxis and treatment of protein kinase mediated diseases, including inflammation and related conditions. The compounds have a general Formula I wherein A1, A2, B, R2 and R3 are defined herein. The invention also comprises pharmaceutical compositions including one or more compounds of Formula I, uses of such compounds and compositions for treatment of kinase mediated diseases including rheumatoid arthritis, psoriasis and other inflammation disorders, as well as intermediates and processes useful for the preparation of compounds of Formula I.
Public/Granted literature
- US07745449B2 Thieno-[2,3-d]pyrimidine and thieno-pyridazine compounds and methods of use Public/Granted day:2010-06-29
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