发明申请
- 专利标题： Surface Mount Light Emitting Chip Package
- 专利标题（中）： 表面贴装发光芯片封装
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申请号： US10582377申请日： 2004-12-09
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公开(公告)号： US20080035947A1公开(公告)日： 2008-02-14
- 发明人: Stanton Earl Weaver Jr. , Chen-Lun Hsing Chen , Boris Kolodin , Thomas Elliot Stecher , James Reginelli , Deborah Ann Haitko , Xiang Gao , Ivan Eliashevich
- 申请人： Stanton Earl Weaver Jr. , Chen-Lun Hsing Chen , Boris Kolodin , Thomas Elliot Stecher , James Reginelli , Deborah Ann Haitko , Xiang Gao , Ivan Eliashevich
- 国际申请： PCT/US04/41392 WO 20041209
- 主分类号： H01L33/00
- IPC分类号： H01L33/00
摘要：
A surface mount light emitting package includes a chip carrier having top and bottom principal surfaces. At least one light emitting chip is attached to the top principal surface of the chip carrier. A lead frame attached to the top principal surface of the chip carrier. When surface mounted to an associated support, the bottom principal surface of the chip carrier is in thermal contact with the associated support without the lead frame intervening therebetween.
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