Invention Application
- Patent Title: Surface Mount Light Emitting Chip Package
- Patent Title (中): 表面贴装发光芯片封装
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Application No.: US10582377Application Date: 2004-12-09
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Publication No.: US20080035947A1Publication Date: 2008-02-14
- Inventor: Stanton Earl Weaver Jr. , Chen-Lun Hsing Chen , Boris Kolodin , Thomas Elliot Stecher , James Reginelli , Deborah Ann Haitko , Xiang Gao , Ivan Eliashevich
- Applicant: Stanton Earl Weaver Jr. , Chen-Lun Hsing Chen , Boris Kolodin , Thomas Elliot Stecher , James Reginelli , Deborah Ann Haitko , Xiang Gao , Ivan Eliashevich
- International Application: PCT/US04/41392 WO 20041209
- Main IPC: H01L33/00
- IPC: H01L33/00
Abstract:
A surface mount light emitting package includes a chip carrier having top and bottom principal surfaces. At least one light emitting chip is attached to the top principal surface of the chip carrier. A lead frame attached to the top principal surface of the chip carrier. When surface mounted to an associated support, the bottom principal surface of the chip carrier is in thermal contact with the associated support without the lead frame intervening therebetween.
Information query
IPC分类:
