发明申请
US20080036055A1 Semiconductor package and method of making using leadframe having lead locks to secure leads to encapsulant
有权
半导体封装和使用具有引线锁的引线框的方法,以将引线固定到密封剂
- 专利标题: Semiconductor package and method of making using leadframe having lead locks to secure leads to encapsulant
- 专利标题(中): 半导体封装和使用具有引线锁的引线框的方法,以将引线固定到密封剂
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申请号: US11365246申请日: 2006-03-01
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公开(公告)号: US20080036055A1公开(公告)日: 2008-02-14
- 发明人: Jae Yee , Young Chung , Jae Lee , Terry Davis , Chung Han , Jae Ku , Jae Kwak , Sang Ryu
- 申请人: Jae Yee , Young Chung , Jae Lee , Terry Davis , Chung Han , Jae Ku , Jae Kwak , Sang Ryu
- 优先权: KR98-49887 19981120; KR98-52924 19991203; KR98-63126 19981231
- 主分类号: H01L23/495
- IPC分类号: H01L23/495 ; H01L21/98
摘要:
A lead frame for making a semiconductor package is disclosed. The leadframe's leads include a lead lock provided at a free end of each inner lead that is adapted to increase a bonding force of the inner lead to a resin encapsulate, thereby effectively preventing a separation of the inner lead from occurring in a singulation process involved in the fabrication of the semiconductor package. A semiconductor package fabricated using the lead frame and a fabrication method for the semiconductor package are also disclosed. The lead frame includes a paddle, a plurality of tie bars for supporting the corners of the paddle, a plurality of leads arranged at each of four sides or two facing sides of the paddle in such a fashion that they are spaced apart from an adjacent side of the paddle while extending perpendicularly to the associated side of the paddle, each of the leads having lead separation preventing means adapted to increase a bonding force of the lead to a resin encapsulate subsequently molded to encapsulate the lead frame for fabrication of the semiconductor package, and dam bars for supporting the leads and the tie bars. Additional package embodiments include exposed protrusions extending downward from the leads. The exposed protrusions are irradiated with a laser to remove set resin prior to a solder ball attachment step.