公开(公告)号：US20080036055A1

公开(公告)日：2008-02-14

申请号：US11365246

申请日：2006-03-01

申请人： Jae Yee ,  Young Chung ,  Jae Lee ,  Terry Davis ,  Chung Han ,  Jae Ku ,  Jae Kwak ,  Sang Ryu

发明人： Jae Yee ,  Young Chung ,  Jae Lee ,  Terry Davis ,  Chung Han ,  Jae Ku ,  Jae Kwak ,  Sang Ryu

IPC分类号： H01L23/495 ,  H01L21/98

CPC分类号： H01L23/3107 ,  H01L23/4951 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49551 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/05599 ,  H01L2224/29007 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0106 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： A lead frame for making a semiconductor package is disclosed. The leadframe's leads include a lead lock provided at a free end of each inner lead that is adapted to increase a bonding force of the inner lead to a resin encapsulate, thereby effectively preventing a separation of the inner lead from occurring in a singulation process involved in the fabrication of the semiconductor package. A semiconductor package fabricated using the lead frame and a fabrication method for the semiconductor package are also disclosed. The lead frame includes a paddle, a plurality of tie bars for supporting the corners of the paddle, a plurality of leads arranged at each of four sides or two facing sides of the paddle in such a fashion that they are spaced apart from an adjacent side of the paddle while extending perpendicularly to the associated side of the paddle, each of the leads having lead separation preventing means adapted to increase a bonding force of the lead to a resin encapsulate subsequently molded to encapsulate the lead frame for fabrication of the semiconductor package, and dam bars for supporting the leads and the tie bars. Additional package embodiments include exposed protrusions extending downward from the leads. The exposed protrusions are irradiated with a laser to remove set resin prior to a solder ball attachment step.

摘要翻译： 公开了一种用于制造半导体封装的引线框架。 引线框架的引线包括提供在每个内引线的自由端处的引线锁，其适于增加内引线与树脂封装件的结合力，从而有效地防止内引线的分离在所涉及的单个加工过程中发生 制造半导体封装。 还公开了使用引线框制造的半导体封装和用于半导体封装的制造方法。 引线框架包括桨，用于支撑桨的角的多个连杆，多个引线，其布置在桨的四个侧面或两个相对的侧面中，使得它们与相邻侧面间隔开 的叶片，同时垂直于桨叶的相关侧延伸，每个引线具有引线分离防止装置，其适于增加引线与随后模制的树脂封装件的结合力，以封装引线框架以制造半导体封装， 和用于支撑引线和连接条的阻挡条。 另外的封装实施例包括从引线向下延伸的暴露突起。 在焊球附着步骤之前，用激光照射暴露的突起以去除固化树脂。

公开(公告)号：US10235977B1

公开(公告)日：2019-03-19

申请号：US15682866

申请日：2017-08-22

申请人： Terry Davis

发明人： Terry Davis

IPC分类号： G10D3/16

摘要： A guitar picking device includes a first securement body, having a first lip to secure around a first finger; a second securement body, having a second lip to secure around a second finger; and a guitar pick secured between the first securement body and the second securement body; the guitar pick faces away from a user's knuckles when the first securement body and the second securement body are secured around the first and second finger.

公开(公告)号：US07183630B1

公开(公告)日：2007-02-27

申请号：US10459230

申请日：2003-06-11

申请人： Harry J. Fogelson ,  Ludcvico Estrada Bancod ,  Ahmer Syed ,  Terry Davis ,  Primitivo A. Palasi ,  William M. Anderson

发明人： Harry J. Fogelson ,  Ludcvico Estrada Bancod ,  Ahmer Syed ,  Terry Davis ,  Primitivo A. Palasi ,  William M. Anderson

IPC分类号： H01L23/495

CPC分类号： H01L21/568 ,  H01L21/561 ,  H01L23/3107 ,  H01L23/49548 ,  H01L23/49582 ,  H01L2924/0002 ,  H05K3/3426 ,  Y02P70/613 ,  H01L2924/00

摘要： A lead frame comprising a frame which defines a central opening. Disposed within the central opening is a die pad which is connected to the frame. Also connected to the frame are a plurality of leads which extend within the opening toward the die pad. Each of the leads defines opposed top and bottom surfaces, an inner end, an outer end, and an opposed pair of side surfaces. The bottom surface and the outer end collectively define a corner region of the lead. Formed within the corner region is a recess which is sized and configured to accommodate the flow of reflow solder thereinto.

摘要翻译： 引线框架，其包括限定中心开口的框架。 设置在中央开口内的是与框架连接的管芯焊盘。 还连接到框架的是在开口内朝向管芯焊盘延伸的多个引线。 每个引线限定相对的顶表面和底表面，内端，外端和相对的一对侧表面。 底表面和外端共同限定引线的拐角区域。 形成在拐角区域内的是凹槽，其尺寸和构造适于容纳回流焊料的流动。

公开(公告)号：US20080277848A1

公开(公告)日：2008-11-13

申请号：US11745962

申请日：2007-05-08

申请人： Terry Davis

发明人： Terry Davis

IPC分类号： B62K25/08 ,  F16D57/00

CPC分类号： B62K25/08 ,  F16F9/062 ,  F16F9/063

摘要： A telescopic shock absorber for a motorcycle includes a slider tube, a stanchion tube, a damping valve, and a hollow damping rod. The damping rod includes a lower end portion secured within the slider tube with a plurality of longitudinally offset orifices. At least one of the orifices is positioned near the valve such that the orifice moves above the valve under sufficient compressive shock to the slider tube during riding. The damping rod also includes an upper end portion extending within the lower end of the stanchion tube. A mid-portion extends between the upper and lower end portions with an outer diameter smaller than those of the end portions. Steps are provided between the mid-portion and the upper and lower end portions. The mid-portion is positioned adjacent the damping valve when the vehicle is in a static, rider-sag state.

摘要翻译： 用于摩托车的伸缩式减震器包括滑动管，支柱管，阻尼阀和中空阻尼杆。 阻尼杆包括固定在滑块管内的多个纵向偏移孔的下端部。 至少一个孔位于阀附近，使得孔在骑行期间在足够的压缩冲击下移动到滑阀上方。 阻尼杆还包括在支柱管的下端内延伸的上端部。 中间部分在上端部和下端部之间延伸，外径小于端部部分的外径。 在中部和上端部和下端部之间设置有台阶。 当车辆处于静止的骑车人陷落状态时，中部位于邻近阻尼阀的位置。

公开(公告)号：US20070176287A1

公开(公告)日：2007-08-02

申请号：US10812274

申请日：2004-03-29

申请人： Sean Crowley ,  Ludovico Bancod ,  Terry Davis ,  Robert Darveaux ,  Michael Gaynor

发明人： Sean Crowley ,  Ludovico Bancod ,  Terry Davis ,  Robert Darveaux ,  Michael Gaynor

IPC分类号： H01L23/34

CPC分类号： H01L23/3121 ,  H01L23/66 ,  H01L24/28 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/05554 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48195 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/078 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19015 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor package comprising a non-conductive film which defines opposed top and bottom film surfaces and includes a plurality of vias disposed therein. Disposed on the top film surface is a plurality of upper leads which circumvent respective ones of the vias. Similarly, disposed on the bottom film surface is a plurality of lower leads which circumvent respective ones of the vias and are electrically connected to respective ones of the upper leads. At least one transmission line element is also disposed on the top film surface and electrically connected to at least one of the upper leads. Attached to the top film surface and electrically connected to at least one of the upper leads and the transmission line element is at least one semiconductor die. A package body at least partially covers the semiconductor die, the upper leads, the transmission line element, and the top film surface.

摘要翻译： 一种半导体封装，其包括限定相对的顶部和底部膜表面的非导电膜，并且包括设置在其中的多个通孔。 设置在顶部薄膜表面上的是多个上引线，其绕过各个通孔。 类似地，设置在底部薄膜表面上的是多个下引线，其围绕相应的通孔并电连接到相应的上引线。 至少一个传输线元件也设置在顶部膜表面上并电连接到至少一个上部引线。 连接到顶部膜表面并电连接到上引线和传输线元件中的至少一个是至少一个半导体管芯。 封装体至少部分地覆盖半导体管芯，上部引线，传输线元件和顶部膜表面。

公开(公告)号：US07564122B2

公开(公告)日：2009-07-21

申请号：US11365246

申请日：2006-03-01

申请人： Jae Hak Yee ,  Young Suk Chung ,  Jae Jin Lee ,  Terry Davis ,  Chung Suk Han ,  Jae Hun Ku ,  Jae Sung Kwak ,  Sang Hyun Ryu

发明人： Jae Hak Yee ,  Young Suk Chung ,  Jae Jin Lee ,  Terry Davis ,  Chung Suk Han ,  Jae Hun Ku ,  Jae Sung Kwak ,  Sang Hyun Ryu

IPC分类号： H01L23/495

CPC分类号： H01L23/3107 ,  H01L23/4951 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49551 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/05599 ,  H01L2224/29007 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0106 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： A lead frame for making a semiconductor package is disclosed. The leadframe's leads include a lead lock provided at a free end of each inner lead that is adapted to increase a bonding force of the inner lead to a resin encapsulate, thereby effectively preventing a separation of the inner lead from occurring in a singulation process involved in the fabrication of the semiconductor package. A semiconductor package fabricated using the lead frame and a fabrication method for the semiconductor package are also disclosed. The lead frame includes a paddle, a plurality of tie bars for supporting the corners of the paddle, a plurality of leads arranged at each of four sides or two facing sides of the paddle in such a fashion that they are spaced apart from an adjacent side of the paddle while extending perpendicularly to the associated side of the paddle, each of the leads having lead separation preventing means adapted to increase a bonding force of the lead to a resin encapsulate subsequently molded to encapsulate the lead frame for fabrication of the semiconductor package, and dam bars for supporting the leads and the tie bars. Additional package embodiments include exposed protrusions extending downward from the leads. The exposed protrusions are irradiated with a laser to remove set resin prior to a solder ball attachment step.

摘要翻译： 公开了一种用于制造半导体封装的引线框架。 引线框架的引线包括提供在每个内引线的自由端处的引线锁，其适于增加内引线与树脂封装件的结合力，从而有效地防止内引线的分离在所涉及的单个加工过程中发生 制造半导体封装。 还公开了使用引线框制造的半导体封装和用于半导体封装的制造方法。 引线框架包括桨，用于支撑桨的角的多个连杆，多个引线，其布置在桨的四个侧面或两个相对的侧面中，使得它们与相邻侧面间隔开 的叶片，同时垂直于桨叶的相关侧延伸，每个引线具有引线分离防止装置，其适于增加引线与随后模制的树脂封装件的结合力，以封装引线框架以制造半导体封装， 和用于支撑引线和连接条的阻挡条。 另外的封装实施例包括从引线向下延伸的暴露突起。 在焊球附着步骤之前，用激光照射暴露的突起以去除固化树脂。

公开(公告)号：US07057280B2

公开(公告)日：2006-06-06

申请号：US10667227

申请日：2003-09-18

申请人： Jae Hak Yee ,  Young Suk Chung ,  Jae Jin Lee ,  Terry Davis ,  Chung Suk Han ,  Jae Hun Ku ,  Jae Sung Kwak ,  Sang Hyun Ryu

发明人： Jae Hak Yee ,  Young Suk Chung ,  Jae Jin Lee ,  Terry Davis ,  Chung Suk Han ,  Jae Hun Ku ,  Jae Sung Kwak ,  Sang Hyun Ryu

IPC分类号： H01L23/04

CPC分类号： H01L23/3107 ,  H01L23/4951 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49551 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/05599 ,  H01L2224/29007 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0106 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： A lead frame for making a semiconductor package is disclosed. The leadframe's leads include a lead lock provided at a free end of each inner lead that is adapted to increase a bonding force of the inner lead to a resin encapsulate, thereby effectively preventing a separation of the inner lead from occurring in a singulation process involved in the fabrication of the semiconductor package. A semiconductor package fabricated using the lead frame and a fabrication method for the semiconductor package are also disclosed. The lead frame includes a paddle, a plurality of tie bars for supporting the corners of the paddle, a plurality of leads arranged at each of four sides or two facing sides of the paddle in such a fashion that they are spaced apart from an adjacent side of the paddle while extending perpendicularly to the associated side of the paddle, each of the leads having lead separation preventing means adapted to increase a bonding force of the lead to a resin encapsulate subsequently molded to encapsulate the lead frame for fabrication of the semiconductor package, and dam bars for supporting the leads and the tie bars. Additional package embodiments include exposed protrusions extending downward from the leads. The exposed protrusions are irradiated with a laser to remove set resin prior to a solder ball attachment step.

摘要翻译： 公开了一种用于制造半导体封装的引线框架。 引线框架的引线包括提供在每个内引线的自由端处的引线锁，其适于增加内引线与树脂封装件的结合力，从而有效地防止内引线的分离在所涉及的单个加工过程中发生 制造半导体封装。 还公开了使用引线框制造的半导体封装和用于半导体封装的制造方法。 引线框架包括桨，用于支撑桨的角的多个连杆，多个引线，其布置在桨的四个侧面或两个相对的侧面中，使得它们与相邻侧面间隔开 的叶片，同时垂直于桨叶的相关侧延伸，每个引线具有引线分离防止装置，其适于增加引线与随后模制的树脂封装件的结合力，以封装引线框架以制造半导体封装， 和用于支撑引线和连接条的阻挡条。 另外的封装实施例包括从引线向下延伸的暴露突起。 在焊球附着步骤之前，用激光照射暴露的突起以去除固化树脂。

公开(公告)号：US20050232280A1

公开(公告)日：2005-10-20

申请号：US10826070

申请日：2004-04-16

申请人： Gordon Letney ,  John Bender ,  Brian Skeen ,  Carlos Montes ,  Andrew Dul ,  Terry Davis

发明人： Gordon Letney ,  John Bender ,  Brian Skeen ,  Carlos Montes ,  Andrew Dul ,  Terry Davis

IPC分类号： H04L12/56 ,  H04L29/12

CPC分类号： H04L29/12311 ,  H04L29/12216 ,  H04L29/12933 ,  H04L45/04 ,  H04L45/54 ,  H04L61/2007 ,  H04L61/2084 ,  H04L61/6068

摘要： A routing system operably links a mobile platform to the Internet. The system includes a ground based communications link manager linkable to the mobile platform. At least one ground based prefix server can communicate with the communications link manager. An initial Internet address is assigned to the mobile platform. A prefix server program communicates the initial destination address of the mobile platform to the communications link manager and to the Internet. During a travel segment of the mobile platform a new destination address can be communicated to the Internet using the prefix server to maintain communication between the mobile platform and the Internet.

摘要翻译： 路由系统可操作地将移动平台连接到因特网。 该系统包括可连接到移动平台的基于地面的通信链路管理器。 至少一个基于地面的前缀服务器可以与通信链路管理器进行通信。 初始的互联网地址被分配给移动平台。 前缀服务器程序将移动平台的初始目的地地址传送到通信链路管理器和因特网。 在移动平台的旅行段期间，可以使用前缀服务器将新的目的地地址传送到因特网，以维持移动平台与因特网之间的通信。

公开(公告)号：US06825062B2

公开(公告)日：2004-11-30

申请号：US10152945

申请日：2002-05-22

申请人： Jae Hak Yee ,  Young Suk Chung ,  Jae Jin Lee ,  Terry Davis ,  Chung Suk Han ,  Jae Hun Ku ,  Jae Sung Kwak ,  Sang Hyun Ryu

发明人： Jae Hak Yee ,  Young Suk Chung ,  Jae Jin Lee ,  Terry Davis ,  Chung Suk Han ,  Jae Hun Ku ,  Jae Sung Kwak ,  Sang Hyun Ryu

IPC分类号： H01L2144

CPC分类号： H01L23/3107 ,  H01L23/4951 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49551 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/05599 ,  H01L2224/29007 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0106 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： A lead frame for making a semiconductor package is disclosed. The leadframe's leads include a lead lock provided at a free end of each inner lead that is adapted to increase a bonding force of the inner lead to a resin encapsulate, thereby effectively preventing a separation of the inner lead from occurring in a singulation process involved in the fabrication of the semiconductor package. A semiconductor package fabricated using the lead frame and a fabrication method for the semiconductor package are also disclosed. The lead frame includes a paddle, a plurality of tie bars for supporting the corners of the paddle, a plurality of leads arranged at each of four sides or two facing sides of the paddle in such a fashion that they are spaced apart from an adjacent side of the paddle while extending perpendicularly to the associated side of the paddle, each of the leads having lead separation preventing means adapted to increase a bonding force of the lead to a resin encapsulate subsequently molded to encapsulate the lead frame for fabrication of the semiconductor package, and dam bars for supporting the leads and the tie bars. Additional package embodiments include exposed protrusions extending downward from the leads. The exposed protrusions are irradiated with a laser to remove set resin prior to a solder ball attachment step.

摘要翻译： 公开了一种用于制造半导体封装的引线框架。 引线框架的引线包括提供在每个内引线的自由端处的引线锁，其适于增加内引线与树脂封装件的结合力，从而有效地防止内引线的分离在所涉及的单个加工过程中发生 制造半导体封装。 还公开了使用引线框制造的半导体封装和用于半导体封装的制造方法。 引线框架包括桨，用于支撑桨的角的多个连杆，多个引线，其布置在桨的四个侧面或两个相对的侧面中，使得它们与相邻侧面间隔开 的叶片，同时垂直于桨叶的相关侧延伸，每个引线具有引线分离防止装置，其适于增加引线与随后模制的树脂封装件的结合力，以封装引线框架以制造半导体封装， 和用于支撑引线和连接条的阻挡条。 另外的封装实施例包括从引线向下延伸的暴露突起。 在焊球附着步骤之前，用激光照射暴露的突起以去除固化树脂。

公开(公告)号：US06448633B1

公开(公告)日：2002-09-10

申请号：US09444035

申请日：1999-11-19

申请人： Jae Hak Yee ,  Young Suk Chung ,  Jae Jin Lee ,  Terry Davis ,  Chung Suk Han ,  Jae Hun Ku ,  Jae Sung Kwak ,  Sang Hyun Ryu

发明人： Jae Hak Yee ,  Young Suk Chung ,  Jae Jin Lee ,  Terry Davis ,  Chung Suk Han ,  Jae Hun Ku ,  Jae Sung Kwak ,  Sang Hyun Ryu

IPC分类号： H01L23495

CPC分类号： H01L23/3107 ,  H01L23/4951 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49551 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/05599 ,  H01L2224/29007 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0106 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： A lead frame for making a semiconductor package is disclosed. The leadframe's leads include a lead lock provided at a free end of each inner lead that is adapted to increase a bonding force of the inner lead to a resin encapsulate, thereby effectively preventing a separation of the inner lead from occurring in a singulation process involved in the fabrication of the semiconductor package. A semiconductor package fabricated using the lead frame and a fabrication method for the semiconductor package are also disclosed. The lead frame includes a paddle, a plurality of tie bars for supporting the comers of the paddle, a plurality of leads arranged at each of four sides or two facing sides of the paddle in such a fashion that they are spaced apart from an adjacent side of the paddle while extending perpendicularly to the associated side of the paddle, each of the leads having lead separation preventing means adapted to increase a bonding force of the lead to a resin encapsulate subsequently molded to encapsulate the lead frame for fabrication of the semiconductor package, and dam bars for supporting the leads and the tie bars. Additional package embodiments include exposed protrusions extending downward from the leads. The exposed protrusions are irradiated with a laser to remove set resin prior to a solder ball attachment step.

摘要翻译： 公开了一种用于制造半导体封装的引线框架。 引线框架的引线包括提供在每个内引线的自由端处的引线锁，其适于增加内引线与树脂封装件的结合力，从而有效地防止内引线的分离在所涉及的单个加工过程中发生 制造半导体封装。 还公开了使用引线框制造的半导体封装和用于半导体封装的制造方法。 引线框架包括桨，用于支撑桨的角的多个连杆，多个引线布置在桨的四个侧面或两个相对的侧面中，使得它们与相邻侧面间隔开 的叶片，同时垂直于桨叶的相关侧延伸，每个引线具有引线分离防止装置，其适于增加引线与随后模制的树脂封装件的结合力，以封装引线框架以制造半导体封装， 和用于支撑引线和连接条的阻挡条。 另外的封装实施例包括从引线向下延伸的暴露突起。 在焊球附着步骤之前，用激光照射暴露的突起以去除固化树脂。