Invention Application
US20080036069A1 Production equipment of resin molding semiconductor device, method of manufacturing resin molding semiconductor device, and resin molding semiconductor device
失效
树脂成形用半导体装置的制造装置，树脂成形用半导体装置的制造方法以及树脂成形用半导体装置
- Patent Title: Production equipment of resin molding semiconductor device, method of manufacturing resin molding semiconductor device, and resin molding semiconductor device
- Patent Title (中): 树脂成形用半导体装置的制造装置，树脂成形用半导体装置的制造方法以及树脂成形用半导体装置
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Application No.: US11812154Application Date: 2007-06-15
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Publication No.: US20080036069A1Publication Date: 2008-02-14
- Inventor: Tetsuo Ito , Takayuki Yoshida , Toshiyuki Fukuda , Takao Ochi
- Applicant: Tetsuo Ito , Takayuki Yoshida , Toshiyuki Fukuda , Takao Ochi
- Applicant Address: JP Kadoma-shi
- Assignee: Matsushita Electric Industrial Co., Ltd.
- Current Assignee: Matsushita Electric Industrial Co., Ltd.
- Current Assignee Address: JP Kadoma-shi
- Priority: JP2006-219069 20060811
- Main IPC: H01L23/48
- IPC: H01L23/48 ; B29C45/00 ; H01L21/56
Abstract:
A production equipment includes a substrate 2 placed inside and having a plurality of semiconductor elements 3 mounted thereon, and a resin molding mold 20 having a cavity 21. The mold 20 has resin injection ports 29a and air release ports 30a. Each of the resin injection ports 29a is formed in a top surface portion of the cavity in the mold in association with the corresponding semiconductor element 3. Each of the air release ports 30a is formed around each of the resin injection ports 29a.
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