发明申请
- 专利标题: INTERCONNECTION STRUCTURE OF INTEGRATED CIRCUIT CHIP
- 专利标题(中): 集成电路芯片的互连结构
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申请号: US11875713申请日: 2007-10-19
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公开(公告)号: US20080036081A1公开(公告)日: 2008-02-14
- 发明人: Se-Young JEONG , Sung-Min SIM , Soon-Bum KIM , In-Young LEE , Young-Hee SONG
- 申请人: Se-Young JEONG , Sung-Min SIM , Soon-Bum KIM , In-Young LEE , Young-Hee SONG
- 申请人地址: KR Gyeonggi-do
- 专利权人: SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人: SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人地址: KR Gyeonggi-do
- 优先权: KR2004-60188 20040730
- 主分类号: H01L23/48
- IPC分类号: H01L23/48
摘要:
An interconnection structure includes an integrated circuit (IC) chip having internal circuitry and a terminal to electrically connect the internal circuitry to an external circuit, a passivation layer disposed on a top surface of the IC chip, the passivation layer configured to protect the internal circuitry and to expose the terminal, an input/output (I/O) pad, where the I/O pad includes a first portion in contact with the terminal and a second portion that extends over the passivation layer, and an electroless plating layer disposed on the I/O pad.
公开/授权文献
- US07732319B2 Interconnection structure of integrated circuit chip 公开/授权日:2010-06-08