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    Method of producing a semiconductor wafer using ultraviolet sensitive tape
    7.
    发明授权
    Method of producing a semiconductor wafer using ultraviolet sensitive tape 失效
    使用紫外线敏感胶带制造半导体晶片的方法

    公开(公告)号：US5840614A

    公开(公告)日：1998-11-24

    申请号：US744376

    申请日：1996-11-07

    申请人： Sung Min Sim ,  Do Yun Hwang

    发明人： Sung Min Sim ,  Do Yun Hwang

    IPC分类号： H01L21/301 ,  H01L21/304 ,  H01L21/306 ,  H01L21/68 ,  H01L21/302

    CPC分类号： H01L21/6835 ,  H01L21/3043 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2221/6834

    摘要： A process for producing semiconductor devices using ultraviolet sensitive tape including the steps of forming a plurality of chips on a first surface of a semiconductor wafer, adhering an ultraviolet sensitive tape to the first surface of the semiconductor wafer, back lapping a second surface of the wafer, opposite to the first surface, and irradiating the ultraviolet sensitive tape with ultraviolet rays to release the ultraviolet sensitive tape from the wafer.

    摘要翻译： 一种使用紫外线敏感带的半导体器件的制造方法，包括以下步骤：在半导体晶片的第一表面上形成多个芯片，将紫外线敏感带粘附到半导体晶片的第一表面，背面研磨晶片的第二表面 与第一表面相对，并且用紫外线照射紫外线敏感带以从晶片释放紫外线敏感带。

    Method of manufacturing semiconductor chip package
    8.
    发明授权
    Method of manufacturing semiconductor chip package 失效
    制造半导体芯片封装的方法

    公开(公告)号：US5753532A

    公开(公告)日：1998-05-19

    申请号：US704996

    申请日：1996-08-29

    申请人： Sung Min Sim

    发明人： Sung Min Sim

    IPC分类号： H01L23/48 ,  H01L21/56 ,  H01L23/495 ,  H01L23/50 ,  H01L21/60

    CPC分类号： H01L23/49558 ,  H01L21/565 ,  H01L24/27 ,  H01L24/97 ,  H01L2224/05554 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/181

    摘要： A method for manufacturing semiconductor chip package comprising steps of: (a) preparing a lead frame which comprises a pair of opposing side rails which have a plurality of through holes on their upper surface; a die pad onto which a chip will be mounted; a pair of rows of leads, each row being disposed at both sides of the die pad at a distance; and tiebars for mechanically and integrally connecting said die pad to said side rails; (b) filling a resin compound between leads and curing the resin compound to make dambars; (c) attaching said chip to an upper surface of said die pad, and electrically connecting said chip to leads; (d) encapsulating said chip, said die pad, said dambars, a part of said leads and a part of said tiebars to give a package body which is still attached to said lead frame; and (e) cutting said tiebars from lead frame to separate an individual package; and (f) forming leads extending from the package to have an appropriate bend shape is provided.

    摘要翻译： 一种制造半导体芯片封装的方法，包括以下步骤：（a）制备引线框架，该引线框架包括在其上表面上具有多个通孔的一对相对的侧轨; 将安装芯片的芯片焊盘; 一排引线，每排以一定距离设置在管芯焊盘的两侧; 以及用于将所述管芯焊盘机械地和一体地连接到所述侧轨的连杆; （b）在引线之间填充树脂化合物并固化树脂化合物以制成堰塞; （c）将所述芯片附接到所述芯片焊盘的上表面，并将所述芯片电连接到引线; （d）封装所述芯片，所述芯片焊盘，所述绝缘体，所述引线的一部分和所述拉杆的一部分，以给出仍然附接到所述引线框架的封装体; 和（e）从引线框架切割所述拉杆以分离单独的包装; 和（f）形成从封装延伸以具有适当的弯曲形状的引线。

    Method for treating a polyimide surface
    9.
    发明授权
    Method for treating a polyimide surface 失效
    聚酰亚胺表面处理方法

    公开(公告)号：US5543493A

    公开(公告)日：1996-08-06

    申请号：US280769

    申请日：1994-07-26

    申请人： Chan-eon Park ,  Hwang-kyu Yun ,  Sung-min Sim ,  Wan-gyun Choi

    发明人： Chan-eon Park ,  Hwang-kyu Yun ,  Sung-min Sim ,  Wan-gyun Choi

    IPC分类号： C08G73/10 ,  C08J7/12 ,  C08L79/08 ,  H01L21/312 ,  B05D3/10

    CPC分类号： C08J7/12 ,  C08L79/08 ,  C08J2379/08

    摘要： A method for treating a polyimide surface which includes the steps of amine-treating the polyimide surface and drying the thusly amine-treated polyimide surface. The amine-treating step is preferably carried out by immersing the polyimide in an amine solution which includes an amine and a solvent. The amine is preferably an aliphatic, aromatic, or siloxane amine. The drying step is preferably carried out a temperature of about 50.degree.-200.degree. C. The polyimide is preferably a polyimide having at least one imide functional group in its main chain, and is most preferably a polycondensate of at least one dianhydride and at least one diamine.

    摘要翻译： 一种处理聚酰亚胺表面的方法，包括胺处理聚酰亚胺表面并干燥胺处理的聚酰亚胺表面的步骤。 胺处理步骤优选通过将聚酰亚胺浸入包括胺和溶剂的胺溶液中来进行。 胺优选为脂族，芳族或硅氧烷胺。 干燥步骤优选在约-50℃〜200℃的温度下进行。聚酰亚胺优选为主链中具有至少一个酰亚胺官能团的聚酰亚胺，最优选为至少一种二酐的缩聚物，至少 一个二胺。