Invention Application
- Patent Title: MEMORY MODULE, MEMORY MODULE SOCKET AND MAINBOARD USING SAME
- Patent Title (中): 存储模块,存储模块插座和使用相同的主板
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Application No.: US11836286Application Date: 2007-08-09
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Publication No.: US20080038961A1Publication Date: 2008-02-14
- Inventor: Sung-Joo PARK , Kyoung-Sun KIM , Jung-Joon LEE , Jea-Eun LEE
- Applicant: Sung-Joo PARK , Kyoung-Sun KIM , Jung-Joon LEE , Jea-Eun LEE
- Applicant Address: KR Gyeonggi-do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Gyeonggi-do
- Priority: KR10-2006-0076261 20060811
- Main IPC: H01R24/00
- IPC: H01R24/00

Abstract:
A memory module socket disposed on a principal surface of a mainboard, and adapted to mechanically receive and electrically connect a memory module with a mainboard, the memory module socket including a first unit socket having a plurality of first socket pins adapted to electrically connect a first connector disposed on an edge of the memory module, and a second unit socket having a plurality of second socket pins adapted to electrically connect to a second connector disposed on the memory module orthogonal to the first connector, wherein the memory module as installed in the memory module socket is parallel to the principal surface of the mainboard.
Public/Granted literature
- US07540743B2 Memory module, memory module socket and mainboard using same Public/Granted day:2009-06-02
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