发明申请
- 专利标题: MEMORY MODULE, MEMORY MODULE SOCKET AND MAINBOARD USING SAME
- 专利标题(中): 存储模块,存储模块插座和使用相同的主板
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申请号: US11836286申请日: 2007-08-09
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公开(公告)号: US20080038961A1公开(公告)日: 2008-02-14
- 发明人: Sung-Joo PARK , Kyoung-Sun KIM , Jung-Joon LEE , Jea-Eun LEE
- 申请人: Sung-Joo PARK , Kyoung-Sun KIM , Jung-Joon LEE , Jea-Eun LEE
- 申请人地址: KR Gyeonggi-do
- 专利权人: SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人: SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人地址: KR Gyeonggi-do
- 优先权: KR10-2006-0076261 20060811
- 主分类号: H01R24/00
- IPC分类号: H01R24/00
摘要:
A memory module socket disposed on a principal surface of a mainboard, and adapted to mechanically receive and electrically connect a memory module with a mainboard, the memory module socket including a first unit socket having a plurality of first socket pins adapted to electrically connect a first connector disposed on an edge of the memory module, and a second unit socket having a plurality of second socket pins adapted to electrically connect to a second connector disposed on the memory module orthogonal to the first connector, wherein the memory module as installed in the memory module socket is parallel to the principal surface of the mainboard.
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