- 专利标题： SEMICONDUCTOR DEVICE INCLUDING SEMICONDUCTOR ELEMENT SURROUNDED BY AN INSULATING MEMBER AND WIRING STRUCTURES ON UPPER AND LOWER SURFACES OF THE SEMICONDUCTOR ELEMENT AND INSULATING MEMBER, AND MANUFACTURING METHOD THEREOF
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申请号： US11853683申请日： 2007-09-11
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公开(公告)号： US20080044944A1公开(公告)日： 2008-02-21
- 发明人: Shinji WAKISAKA , Hiroyasu Jobetto , Takeshi Wakabayashi , Ichiro Mihara
- 申请人： Shinji WAKISAKA , Hiroyasu Jobetto , Takeshi Wakabayashi , Ichiro Mihara
- 申请人地址： JP Tokyo
- 专利权人： CASIO COMPUTER CO., LTD.
- 当前专利权人： CASIO COMPUTER CO., LTD.
- 当前专利权人地址： JP Tokyo
- 优先权： JP2003-379547 20031110; JP2003-395313 20031126
- 主分类号： H01L21/00
- IPC分类号： H01L21/00
摘要：
A first semiconductor element is mounted on a base plate, and is in a sealed state by the periphery thereof being covered by an insulation member, and the upper surface thereof being covered by an upper insulation film. An upper wiring layer formed on the upper insulation film, and the lower wiring layer formed below the base plate via lower insulation films are connected by conductors. A second semiconductor element is mounted exposed, being connected to the lower wiring layer.