发明申请
- 专利标题： Plastic Housing and Semiconductor Component with Said Plastic Housing and Method for Producing the Same
- 专利标题（中）： 塑料外壳和带塑料外壳的半导体元件及其制造方法
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申请号： US11867132申请日： 2007-10-04
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公开(公告)号： US20080045063A1公开(公告)日： 2008-02-21
- 发明人: Michael Bauer , Peter Strobel , Jens Pohl , Christian Stuempfl , Ludwig Heitzer
- 申请人： Michael Bauer , Peter Strobel , Jens Pohl , Christian Stuempfl , Ludwig Heitzer
- 申请人地址： DE Neubiberg 85579
- 专利权人： Infineon Technologies AG
- 当前专利权人： Infineon Technologies AG
- 当前专利权人地址： DE Neubiberg 85579
- 优先权： DE102005015455.7 20050404
- 主分类号： H01R13/15
- IPC分类号： H01R13/15
摘要：
A plastic housing includes plastic external faces and the underside of the plastic housing comprises external contact areas on which external contacts are arranged. The plastic external faces are covered by a closed metal layer apart from the underside, wherein the boundary layer between plastic external faces and the closed metal layer includes exposed electrically conductive inclusions of the plastic of the housing.