发明申请
- 专利标题： Paste For Soldering And Soldering Method Using The Same
- 专利标题（中）： 用于焊接和焊接方法使用它
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申请号： US10585729申请日： 2005-10-27
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公开(公告)号： US20080048009A1公开(公告)日： 2008-02-28
- 发明人: Tadashi Maeda , Tadahiko Sakai
- 申请人： Tadashi Maeda , Tadahiko Sakai
- 优先权： JP2004-320232 20041104
- 国际申请： PCT/JP05/19749 WO 20051027
- 主分类号： B23K1/20
- IPC分类号： B23K1/20 ; B23K35/22
摘要：
It provides metal-powder-contained flux disposed between bumps and circuit electrodes when electronic parts are mounted by soldering, the metal powder comprises a core metal formed of metal such as tin and zinc and a surface metal covering surfaces of the core metal formed of noble metal such as gold and silver. Accordingly, metal powder will not remain as residue that is liable to cause migration after the reflow process, and it is possible to assure both soldering effect and insulation effect.
公开/授权文献
- US08083121B2 Paste for soldering and soldering method using the same 公开/授权日：2011-12-27
信息查询
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