公开(公告)号：US20240286229A1

公开(公告)日：2024-08-29

申请号：US18585429

申请日：2024-02-23

申请人： PRINCE & IZANT, LLC

发明人： KRISTINA PAVLOVNA DYSHKO ,  WARREN MARTIN ANDRE MIGLIETTI

IPC分类号： B23K35/22 ,  B23K1/018 ,  B23K1/20 ,  B23K35/36

CPC分类号： B23K35/224 ,  B23K1/018 ,  B23K1/20 ,  B23K35/3602

摘要： Provided herein is a stop-off material for a brazing process. The stop-off material includes a solvent, a thickener, and magnesium oxide. About 5 weight percent to about 60 weight percent of the stop-off material comprises the magnesium oxide. The stop-off material is configured to be removed from a surface after heating and via air pressure.

公开(公告)号：US11832386B2

公开(公告)日：2023-11-28

申请号：US17644593

申请日：2021-12-16

申请人： Dell Products L.P.

发明人： Deeder M. Aurongzeb

IPC分类号： B23K35/00 ,  H05K1/09 ,  H05K3/40 ,  B23K35/26 ,  C22C13/02 ,  B23K35/22 ,  B23K1/00 ,  H05K1/11

CPC分类号： H05K1/09 ,  B23K1/0016 ,  B23K35/22 ,  B23K35/262 ,  C22C13/02 ,  H05K3/4007 ,  H05K1/115 ,  H05K1/119 ,  H05K2201/0323 ,  H05K2201/0338 ,  H05K2203/043 ,  H05K2203/0759 ,  H05K2203/1333 ,  H05K2203/1366

摘要： A solder composition for use in solder joints of printed circuit boards (PCBs), including a compound layer comprising an alloy of bismuth and tin; and a graphene coating positioned on the compound layer.

公开(公告)号：US11441039B2

公开(公告)日：2022-09-13

申请号：US17127209

申请日：2020-12-18

申请人： GM Global Technology Operations LLC

发明人： Zhenke Teng ,  Jason M. Brown ,  Thomas R. Jones ,  Pei-chung Wang ,  Michael J. Karagoulis

IPC分类号： C23C2/12 ,  C09D5/10 ,  C25D3/44 ,  B23K35/22 ,  C23C2/06 ,  C25D3/22 ,  C25D21/00 ,  C25D21/12

摘要： A high temperature substrate coating to mitigate liquid metal embrittlement (LME) cracking in automobile vehicles includes a substrate. A coating is disposed on the substrate, the coating being one of a zinc-based material and an aluminum-based material, with the coating having a melting point of at least 500° C.

公开(公告)号：US11408690B2

公开(公告)日：2022-08-09

申请号：US16459585

申请日：2019-07-01

申请人： UACJ CORPORATION

发明人： Makoto Ando ,  Atsushi Fukumoto ,  Akio Niikura

IPC分类号： B23K35/22 ,  B23K20/04 ,  F28F21/08 ,  F28F19/06 ,  C22C21/00 ,  B23K20/233 ,  C22F1/04 ,  B23K35/28 ,  C23F13/14 ,  B23P15/26 ,  B32B15/01 ,  C22C21/02 ,  C22C21/08 ,  C22C21/10 ,  C22C21/14 ,  B23K101/14 ,  B23K101/34 ,  B23K103/10

摘要： A method for producing an aluminum alloy clad material having a core material and a sacrificial anode material clad on at least one surface of the core material, wherein the core material comprises an aluminum alloy comprising 0.050 to 1.5 mass % (referred to as “%” below) Si, 0.050 to 2.0% Fe and 0.50 to 2.00% Mn; the sacrificial anode material includes an aluminum alloy containing 0.50 to 8.00% Zn, 0.05 to 1.50% Si and 0.050 to 2.00% Fe; the grain size of the sacrificial anode material is 60 μm or more; and a ratio R1/R2 is 0.30 or less, wherein R1 (μm) is a grain size in a thickness direction and R2 (μm) is a grain size in a rolling direction in a cross section of the core material along the rolling direction; a production method thereof; and a heat exchanger using the clad.

公开(公告)号：US10857628B2

公开(公告)日：2020-12-08

申请号：US15804061

申请日：2017-11-06

申请人： The Boeing Company

发明人： Austin E. Mann

IPC分类号： B23K20/12 ,  B23K35/22 ,  B23K35/00 ,  B23K20/227 ,  B23K20/24 ,  B23K20/16 ,  B32B15/01 ,  B23K103/24 ,  B23K101/18

摘要： An interlayered structure for joining of dissimilar materials includes: a first material substrate; a second material substrate having a composition dissimilar from a composition of the first material substrate; and a plurality of interlayers disposed between the first material substrate and the second material substrate, including a first interlayer nearest to the first material substrate and a last interlayer nearest to the second material substrate. The first interlayer has a composition selected to have a maximum solid solubility within the composition of the first material substrate that is greater than or equal to the other interlayers within the composition of the first material substrate, and the last interlayer has a composition selected to have a maximum solid solubility within the composition of the second material substrate that is greater than or equal to the other interlayers within the composition of the second material substrate.

公开(公告)号：US10739679B2

公开(公告)日：2020-08-11

申请号：US16458930

申请日：2019-07-01

申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION

发明人： Matthew Kelly ,  Mark Jeanson ,  Joseph Kuczynski

IPC分类号： G03F7/032 ,  G03F7/028 ,  G03F7/038 ,  G03F7/027 ,  B23K35/22 ,  G03F7/039 ,  H01L21/48 ,  G03F7/004 ,  B23K35/02 ,  B23K35/36 ,  G03F7/26

摘要： Disclosed herein are solder mask formulations that include a liquid photo imagable solution and a solution of functionalized diamondoids. Also disclosed are semiconductor fabrication methods that include applying a described solder mask formulation to a semiconductor device.

公开(公告)号：US10670964B2

公开(公告)日：2020-06-02

申请号：US15819349

申请日：2017-11-21

申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION

发明人： Matthew Kelly ,  Mark Jeanson ,  Joseph Kuczynski

IPC分类号： G03F7/032 ,  G03F7/028 ,  G03F7/038 ,  G03F7/027 ,  B23K35/22 ,  G03F7/039 ,  H01L21/48 ,  G03F7/004 ,  B23K35/02 ,  B23K35/36

摘要： Disclosed herein are solder mask formulations that include a liquid photo imageable solution and a solution of functionalized diamondoids. Also disclosed are semiconductor fabrication methods that include applying a described solder mask formulation to a semiconductor device.

公开(公告)号：US10661395B2

公开(公告)日：2020-05-26

申请号：US15325530

申请日：2015-07-29

申请人： UACJ Corporation

发明人： Junichi Ichikawa ,  Tomoki Yamayoshi ,  Yasunaga Itoh ,  Yutaka Yanagawa

IPC分类号： B23K1/00 ,  B23K35/28 ,  B23K31/02 ,  B23K35/22 ,  C22C21/00 ,  B23K1/19 ,  B23K35/02 ,  B32B15/01 ,  B23K1/008 ,  C22C21/02 ,  C22C21/06

摘要： A brazing sheet for brazing in an inert-gas atmosphere without using a flux has a core and a filler material clad to one side or both sides of the core. The core has a chemical composition that contains Mg: 0.35-0.8% (mass %; likewise hereinbelow), the remainder being composed of Al and unavoidable impurities. The filler material has a chemical composition that contains Si: 6-13% and Bi: 0.001-0.05% and Mg: limited less than 0.05%, the remainder being composed of Al and unavoidable impurities.

公开(公告)号：US10544040B2

公开(公告)日：2020-01-28

申请号：US15909431

申请日：2018-03-01

申请人： DunAn Microstaq, Inc.

发明人： Wayne C. Long ,  Joe A. Ojeda ,  Joseph L. Nguyen

IPC分类号： B23K31/02 ,  B81C3/00 ,  B81C1/00 ,  G01K13/02 ,  G01K15/00 ,  H05K3/34 ,  B23K35/22 ,  B23K1/00

摘要： A method of attaching a MEMS die to a mounting surface includes coating an inside surface of a pressure port of a fluid inlet member with a layer of solder mask, the fluid inlet member having a first axial end, a second axial end, and a port opening of the pressure port formed in the second axial end of the fluid inlet member. A solder preform is disposed on the mounting surface of the fluid inlet member and a MEMS die is disposed on the solder preform. The solder preform is heated in a re-flow operation to attach the MEMS die to the mounting surface, wherein the solder mask within the pressure port prevents molten solder from entering the pressure port during the re-flow operation.

公开(公告)号：US10532420B2

公开(公告)日：2020-01-14

申请号：US15702255

申请日：2017-09-12

申请人： GM GLOBAL TECHNOLOGY OPERATIONS LLC

发明人： James G. Schroth ,  Thomas A. Perry ,  Hongliang Wang

IPC分类号： B23K11/11 ,  B23K11/16 ,  B23K11/18 ,  B23K35/22 ,  B23K35/30 ,  B23K103/12

摘要： A method of joining together adjacent overlapping copper workpieces by way of resistance spot welding involves providing a workpiece stack-up that includes a first copper workpiece and a second copper workpiece that lies adjacent to the first copper workpiece. The faying surface of the first copper workpiece includes a projection that ascends beyond a surrounding base surface of the faying surface and makes contact, either directly or indirectly, with an opposed faying surface of the second copper workpiece. Once provided, a compressive force is applied against the first and second copper workpieces and an electric current is passed momentarily through the first and second copper workpieces. The electric current initially flows through the projection to generate and concentrate heat within the projection prior to the projection collapsing. This concentrated heat surge allows a metallurgical joint to be established between the first and second copper workpieces.