Invention Application
- Patent Title: Paste For Soldering And Soldering Method Using The Same
- Patent Title (中): 用于焊接和焊接方法使用它
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Application No.: US10585729Application Date: 2005-10-27
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Publication No.: US20080048009A1Publication Date: 2008-02-28
- Inventor: Tadashi Maeda , Tadahiko Sakai
- Applicant: Tadashi Maeda , Tadahiko Sakai
- Priority: JP2004-320232 20041104
- International Application: PCT/JP05/19749 WO 20051027
- Main IPC: B23K1/20
- IPC: B23K1/20 ; B23K35/22
Abstract:
It provides metal-powder-contained flux disposed between bumps and circuit electrodes when electronic parts are mounted by soldering, the metal powder comprises a core metal formed of metal such as tin and zinc and a surface metal covering surfaces of the core metal formed of noble metal such as gold and silver. Accordingly, metal powder will not remain as residue that is liable to cause migration after the reflow process, and it is possible to assure both soldering effect and insulation effect.
Public/Granted literature
- US08083121B2 Paste for soldering and soldering method using the same Public/Granted day:2011-12-27
Information query
IPC分类:
