发明申请
- 专利标题： Multilayered printed wiring board and method for manufacturing the same
- 专利标题（中）： 多层印刷线路板及其制造方法
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申请号： US11878923申请日： 2007-07-27
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公开(公告)号： US20080049405A1公开(公告)日： 2008-02-28
- 发明人: Takahiro Sahara , Atsushi Kobayashi , Kiyoshi Takeuchi , Masahiko Igaue
- 申请人： Takahiro Sahara , Atsushi Kobayashi , Kiyoshi Takeuchi , Masahiko Igaue
- 专利权人： DAI NIPPON PRINTING CO., LTD.
- 当前专利权人： DAI NIPPON PRINTING CO., LTD.
- 优先权： JPP2006-205641 20060728
- 主分类号： H05K1/18
- IPC分类号： H05K1/18 ; H05K1/11 ; H05K3/32 ; H05K3/36
摘要：
A multilayered printed wiring board includes a plurality of insulating layers; a plurality of wiring layers which are located between the corresponding adjacent insulating layers; and a plurality of interlayer connection conductors for electrically connecting the wiring layers through the insulating layers; wherein a cavity is formed through one or more of the insulating layers so as to insert a first electric/electronic component and an area for embedding a second electric/electronic component is defined for the insulating layers.
公开/授权文献
- US08400776B2 Multilayered printed wiring board 公开/授权日：2013-03-19
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