发明申请
- 专利标题： MULTI-CHIP ASSEMBLY
- 专利标题（中）： 多芯片组合
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申请号： US11470511申请日： 2006-09-06
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公开(公告)号： US20080054451A1公开(公告)日： 2008-03-06
- 发明人: Michael Bauer , Christian Stuempfl , Ludwig Heitzer
- 申请人： Michael Bauer , Christian Stuempfl , Ludwig Heitzer
- 主分类号： H01L23/34
- IPC分类号： H01L23/34
摘要：
Chip arrangement and method for producing a chip arrangementA chip arrangement comprises a first chip with an electrically operable structure on an active surface of the first chip. The first chip is applied on a carrier area in order to make electrical contact with the electrically operable structure via the carrier area. A second chip has a cutout and is arranged on the carrier area, the first chip being arranged in a cavity formed by the cutout and the carrier area.
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IPC分类:
