发明申请
- 专利标题： SEMICONDUCTOR PACKAGE INCLUDING SILVER BUMP AND METHOD FOR FABRICATING THE SAME
- 专利标题（中）： 包含银块的半导体封装及其制造方法
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申请号： US11828409申请日： 2007-07-26
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公开(公告)号： US20080054456A1公开(公告)日： 2008-03-06
- 发明人: Un-byoung KANG , Yong-hwan KWON , Chung-sun LEE , Woon-seong KWON , Hyung-sun JANG
- 申请人： Un-byoung KANG , Yong-hwan KWON , Chung-sun LEE , Woon-seong KWON , Hyung-sun JANG
- 申请人地址： KR Suwon-si
- 专利权人： SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人： SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人地址： KR Suwon-si
- 优先权： KR10-2006-0082923 20060830
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L21/60
摘要：
A semiconductor package includes a semiconductor chip operatively attached to a conductive lead of a film circuit substrate by an indium-containing solder material and a silver-containing bump electrode, where the solder material is interposed between the conductive lead and the bump electrode.
信息查询
IPC分类:
