Invention Application
- Patent Title: SEMICONDUCTOR PACKAGE INCLUDING SILVER BUMP AND METHOD FOR FABRICATING THE SAME
- Patent Title (中): 包含银块的半导体封装及其制造方法
-
Application No.: US11828409Application Date: 2007-07-26
-
Publication No.: US20080054456A1Publication Date: 2008-03-06
- Inventor: Un-byoung KANG , Yong-hwan KWON , Chung-sun LEE , Woon-seong KWON , Hyung-sun JANG
- Applicant: Un-byoung KANG , Yong-hwan KWON , Chung-sun LEE , Woon-seong KWON , Hyung-sun JANG
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Priority: KR10-2006-0082923 20060830
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L21/60
Abstract:
A semiconductor package includes a semiconductor chip operatively attached to a conductive lead of a film circuit substrate by an indium-containing solder material and a silver-containing bump electrode, where the solder material is interposed between the conductive lead and the bump electrode.
Information query
IPC分类:
