发明申请
US20080067668A1 Microelectronic package, method of manufacturing same, and system containing same
审中-公开
微电子封装，制造方法和含有该微电子封装的系统
- 专利标题： Microelectronic package, method of manufacturing same, and system containing same
- 专利标题（中）： 微电子封装，制造方法和含有该微电子封装的系统
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申请号： US11521729申请日： 2006-09-15
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公开(公告)号： US20080067668A1公开(公告)日： 2008-03-20
- 发明人: Wei Shi , Daoqiang Lu , Qing Zhou , Jiangoi He
- 申请人： Wei Shi , Daoqiang Lu , Qing Zhou , Jiangoi He
- 主分类号： H01L23/34
- IPC分类号： H01L23/34
摘要：
A microelectronic package includes a substrate (110), a die (120) electrically connected to the substrate, and a heat dissipation device (130) coupled to the die. The heat dissipation device includes a capacitor (250, 310). In one embodiment the heat dissipation device is a microchannel having a base (131) and a cover plate (132, 300) over the base, and the capacitor is located within the cover plate.
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