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    Microelectronic package, method of manufacturing same, and system containing same
    1.
    发明申请
    Microelectronic package, method of manufacturing same, and system containing same 审中-公开
    微电子封装，制造方法和含有该微电子封装的系统

    公开(公告)号：US20080067668A1

    公开(公告)日：2008-03-20

    申请号：US11521729

    申请日：2006-09-15

    申请人： Wei Shi ,  Daoqiang Lu ,  Qing Zhou ,  Jiangoi He

    发明人： Wei Shi ,  Daoqiang Lu ,  Qing Zhou ,  Jiangoi He

    IPC分类号： H01L23/34

    CPC分类号： H01L23/3735 ,  H01L23/36 ,  H01L23/3675 ,  H01L23/50 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A microelectronic package includes a substrate (110), a die (120) electrically connected to the substrate, and a heat dissipation device (130) coupled to the die. The heat dissipation device includes a capacitor (250, 310). In one embodiment the heat dissipation device is a microchannel having a base (131) and a cover plate (132, 300) over the base, and the capacitor is located within the cover plate.

    摘要翻译： 微电子封装包括基板（110），与基板电连接的管芯（120）以及耦合到管芯的散热器件（130）。 散热装置包括电容器（250,310）。 在一个实施例中，散热装置是具有在基座上方的基座（131）和盖板（132,300）的微通道，并且电容器位于盖板内。

    Substrate with raised edge pads
    2.
    发明授权
    Substrate with raised edge pads 有权
    基片与凸起的边缘垫

    公开(公告)号：US07980865B2

    公开(公告)日：2011-07-19

    申请号：US11315854

    申请日：2005-12-22

    申请人： Wei Shi ,  Daoqiang Lu ,  Qing Zhou ,  Jiangqi He

    发明人： Wei Shi ,  Daoqiang Lu ,  Qing Zhou ,  Jiangqi He

    IPC分类号： H01R12/00

    CPC分类号： H05K7/1061 ,  Y10T29/49117

    摘要： A separable electrical connection may be provided with a landside pad on one of two electrical components to be joined. The landside pad may be made up of two parts, including a flat portion and a raised edge formed on the flat portion. In some embodiments, the raised edge may have a closed geometric shape. Then, a socket contact engaging the junction between the flat portion and the raised edge is prevented from sliding off of the landside pad by the raised edge. In addition, dual areas of electrical connection can be established between both the flat portion and raised edge of the landside pad and the correspondingly shaped pair of portions on the socket. This increases the electrical efficiency of the connection and its security.

    摘要翻译： 可分离的电连接可以在待连接的两个电气部件之一上设置有陆侧焊盘。 侧面垫可以由两部分组成，包括平坦部分和形成在平坦部分上的凸起边缘。 在一些实施例中，凸起边缘可以具有闭合的几何形状。 然后，通过凸起边缘防止接合平坦部分和凸起边缘之间的连接处的插座触点从边缘垫片滑出。 此外，可以在陆侧衬垫的平坦部分和凸起边缘以及插座上的相应形状的一对部分之间建立双重电连接区域。 这增加了连接的电效率及其安全性。

    Edge interconnects for die stacking
    3.
    发明申请
    Edge interconnects for die stacking 审中-公开
    边缘互连用于芯片堆叠

    公开(公告)号：US20070158807A1

    公开(公告)日：2007-07-12

    申请号：US11322297

    申请日：2005-12-29

    申请人： Daoqiang Lu ,  Wei Shi ,  Qing Zhou ,  Jiangqi He

    发明人： Daoqiang Lu ,  Wei Shi ,  Qing Zhou ,  Jiangqi He

    IPC分类号： H01L23/02

    CPC分类号： H01L25/0657 ,  H01L25/50 ,  H01L2224/24145 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06524 ,  H01L2225/06551 ,  H01L2225/06582 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/00014

    摘要： Electronic devices and methods for fabricating electronic devices are described. One embodiment includes an electronic device having a first die, the first die having a top surface, a bottom surface, and a plurality of side surfaces. The first die also includes a plurality of metal pads on the top surface extending to an outer edge of the top surface, and a plurality of metal pads on the bottom surface extending to an outer edge of the bottom surface. The first die also includes a plurality of metal regions along the side surfaces, wherein each of the metal regions extends between one of the metal pads on the top surface and one of the metal pads on the bottom surface. Other embodiments are described and claimed.

    摘要翻译： 描述了用于制造电子设备的电子设备和方法。 一个实施例包括具有第一管芯的电子器件，第一管芯具有顶表面，底表面和多个侧表面。 第一管芯还包括在顶表面上延伸到顶表面的外边缘的多个金属焊盘，以及在底表面上延伸到底表面的外边缘的多个金属焊盘。 第一管芯还包括沿着侧表面的多个金属区域，其中每个金属区域在顶表面上的金属焊盘之一和底表面上的金属焊盘中的一个之间延伸。 描述和要求保护其他实施例。

    Substrate with raised edge pads
    6.
    发明申请
    Substrate with raised edge pads 有权
    基片与凸起的边缘垫

    公开(公告)号：US20070155198A1

    公开(公告)日：2007-07-05

    申请号：US11315854

    申请日：2005-12-22

    申请人： Wei Shi ,  Daoqiang Lu ,  Qing Zhou ,  Jiangqi He

    发明人： Wei Shi ,  Daoqiang Lu ,  Qing Zhou ,  Jiangqi He

    IPC分类号： H01R12/00

    CPC分类号： H05K7/1061 ,  Y10T29/49117

    摘要： A separable electrical connection may be provided with a landside pad on one of two electrical components to be joined. The landside pad may be made up of two parts, including a flat portion and a raised edge formed on the flat portion. In some embodiments, the raised edge may have a closed geometric shape. Then, a socket contact engaging the junction between the flat portion and the raised edge is prevented from sliding off of the landside pad by the raised edge. In addition, dual areas of electrical connection can be established between both the flat portion and raised edge of the landside pad and the correspondingly shaped pair of portions on the socket. This increases the electrical efficiency of the connection and its security.

    摘要翻译： 可分离的电连接可以在待连接的两个电气部件之一上设置有陆侧焊盘。 侧面垫可以由两部分组成，包括平坦部分和形成在平坦部分上的凸起边缘。 在一些实施例中，凸起边缘可以具有闭合的几何形状。 然后，通过凸起边缘防止接合平坦部分和凸起边缘之间的连接处的插座触点从边缘垫片滑出。 此外，可以在陆侧衬垫的平坦部分和凸起边缘以及插座上的相应形状的一对部分之间建立双重电连接区域。 这增加了连接的电效率及其安全性。

    Fluxless heat spreader bonding with cold form solder
    7.
    发明申请
    Fluxless heat spreader bonding with cold form solder 审中-公开
    无焊散热器与冷成型焊料接合

    公开(公告)号：US20070152321A1

    公开(公告)日：2007-07-05

    申请号：US11323904

    申请日：2005-12-29

    申请人： Wei Shi ,  Daoqiang Lu ,  Qing Zhou ,  Jiangqi He

    发明人： Wei Shi ,  Daoqiang Lu ,  Qing Zhou ,  Jiangqi He

    IPC分类号： H01L23/12 ,  H01L21/50

    CPC分类号： H01L21/4871 ,  H01L25/0655 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/16152 ,  H01L2924/00

    摘要： The formation of electronic assemblies including a heat spreader coupled to at least one die is described. One embodiment relates to a method including positioning a solder on a heat spreader. The method also includes forming a solid state diffusion bond between the solder and the heat spreader. The solid state diffusion bonded solder and heat spreader are positioned on a die and heated to a temperature sufficient to melt the solder and form a bond between the solder and the die, in the absence of a flux. Other embodiments are described and claimed.

    摘要翻译： 描述了包括耦合到至少一个管芯的散热器的电子组件的形成。 一个实施例涉及一种包括将焊料定位在散热器上的方法。 该方法还包括在焊料和散热器之间形成固态扩散接合。 固态扩散焊接和散热器位于模具上并加热至足以熔化焊料的温度，并在不存在焊剂的情况下在焊料和管芯之间形成结合。 描述和要求保护其他实施例。

    Multi-chip assembly with optically coupled die
    10.
    发明申请
    Multi-chip assembly with optically coupled die 有权
    具有光耦合模的多芯片组装

    公开(公告)号：US20070102733A1

    公开(公告)日：2007-05-10

    申请号：US11270271

    申请日：2005-11-09

    申请人： Qing Zhou ,  Daoqiang Lu ,  Jiangqi He ,  Wei Shi ,  Xiang Zeng

    发明人： Qing Zhou ,  Daoqiang Lu ,  Jiangqi He ,  Wei Shi ,  Xiang Zeng

    IPC分类号： H01L29/768

    CPC分类号： H01L23/48 ,  H01L25/0652 ,  H01L2924/00014 ,  H01L2224/48

    摘要： Disclosed are embodiments of a multi-chip assembly including optically coupled die. The multi-chip assembly may include two opposing substrates, and a number of die are mounted on each of the substrates. At least one die on one of the substrates is in optical communication with at least one opposing die on the other substrate. Other embodiments are described and claimed.

    摘要翻译： 公开了包括光耦合管芯的多芯片组件的实施例。 多芯片组件可以包括两个相对的基板，并且在每个基板上安装多个管芯。 一个基板上的至少一个管芯与另一个基板上的至少一个相对的管芯光学连通。 描述和要求保护其他实施例。