A set of compositions for preparing a system-in-package type semiconductor device, characterized in that the set of compositions consists of an underfill composition for preparing the underfill part and an encapsulation resin composition for preparing the resin encapsulation part, wherein 1) a cured product of the underfill composition has a glass transition temperature, Tg, which is 100° C. or higher and is the same with or differs from a Tg of a cured product of the encapsulation resin composition by 20° C. or smaller, 2) a total of a linear expansion coefficient of the cured product of the underfill composition at a temperature not higher than (Tg-30)° C. and a linear expansion coefficient of the cured product of the encapsulation resin composition at a temperature not higher than (Tg-30)° C. is 42 ppm/° C. or smaller, and 3) a ratio of the linear expansion coefficient of the cured product of the encapsulation resin composition to the linear expansion coefficient of the cured product of the underfill composition ranges from 0.3 to 1.0.