公开(公告)号：US20120074596A1

公开(公告)日：2012-03-29

申请号：US13289619

申请日：2011-11-04

申请人： Kazuaki Sumita ,  Kaoru Katoh ,  Taro Shimoda

发明人： Kazuaki Sumita ,  Kaoru Katoh ,  Taro Shimoda

IPC分类号： H01L23/28

CPC分类号： H01L23/3128 ,  H01L21/563 ,  H01L23/293 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06575 ,  H01L2225/06582 ,  H01L2225/06586 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01077 ,  H01L2924/01087 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/181 ,  Y10T428/31855 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/0401 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Set of compositions for preparing system-in-package type semiconductor device. The composition set consists of underfill composition for preparing underfill part and encapsulation resin composition for preparing resin encapsulation part. 1) A cured product of the underfill composition has a glass transition temperature, Tg, ≧100° C. and is the same with or differs from a Tg of a cured product of the encapsulation resin composition by ≦20° C. 2) Total linear expansion coefficient of the cured product of the underfill composition at a temperature not higher than (Tg−30)° C. and a linear expansion coefficient of the cured product of the encapsulation resin composition at a temperature not higher than (Tg−30)° C. is ≦42 ppm/° C. 3) A ratio of the linear expansion coefficient of the cured product of the encapsulation resin composition to the linear expansion coefficient of the cured product of the underfill composition ranges from 0.3 to 1.0.

摘要翻译： 一套用于制备系统级封装型半导体器件的组合物。 组合物由用于制备底部填充剂的底部填充组合物和用于制备树脂包封部分的包封树脂组合物组成。 1）底部填充剂组合物的固化物的玻璃化转变温度Tg，≥100℃，与密封树脂组合物的固化物的Tg相同或不同，20℃; 2） 在不高于（Tg-30）℃的温度下，底部填充剂组合物的固化产物的总线膨胀系数和包封树脂组合物的固化产物在不高于（Tg-30） ）℃为42ppm /℃。3）封装树脂组合物的固化物的线膨胀系数与底部填充剂组合物的固化物的线膨胀系数的比为0.3〜1.0。

公开(公告)号：US20090184431A1

公开(公告)日：2009-07-23

申请号：US12289268

申请日：2008-10-23

申请人： Kazuaki Sumita ,  Toshio Shiobara

发明人： Kazuaki Sumita ,  Toshio Shiobara

IPC分类号： H01L23/48 ,  C07F7/08 ,  C08L63/00 ,  C08K3/36

CPC分类号： H01L21/563 ,  H01L23/293 ,  H01L24/31 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83951 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01045 ,  H01L2924/01051 ,  H01L2924/01077 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/0401

摘要： A liquid epoxy resin composition comprising (A) a liquid epoxy resin, (B) an aromatic amine curing agent comprising at least 5% by weight of a specific aromatic amine compound, and (C) an inorganic filler has a low viscosity for ease of working, cures into a cured product which has improved adhesion to the surface of silicon chips, and offers an encapsulated semiconductor device that does not suffer a failure even at a reflow temperature of 260-270° C., does not deteriorate under hot humid conditions, and does not peel or crack on thermal cycling.

摘要翻译： 一种液体环氧树脂组合物，其包含（A）液体环氧树脂，（B）包含至少5重量％的特定芳族胺化合物的芳族胺固化剂和（C）无机填料，其粘度低 工作，固化成固化产品，其具有改善的对硅片表面的粘合性，并提供即使在260-270℃的回流温度下也不会发生故障的封装半导体器件，在热潮湿条件下不劣化 ，并且不会在热循环时剥离或破裂。

公开(公告)号：US20080070054A1

公开(公告)日：2008-03-20

申请号：US11898615

申请日：2007-09-13

申请人： Kazuaki Sumita ,  Kaoru Katoh ,  Taro Shimoda

发明人： Kazuaki Sumita ,  Kaoru Katoh ,  Taro Shimoda

IPC分类号： B32B27/38 ,  C08K9/10

CPC分类号： H01L23/3128 ,  H01L21/563 ,  H01L23/293 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06575 ,  H01L2225/06582 ,  H01L2225/06586 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01077 ,  H01L2924/01087 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/181 ,  Y10T428/31855 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/0401 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A set of compositions for preparing a system-in-package type semiconductor device, characterized in that the set of compositions consists of an underfill composition for preparing the underfill part and an encapsulation resin composition for preparing the resin encapsulation part, wherein 1) a cured product of the underfill composition has a glass transition temperature, Tg, which is 100° C. or higher and is the same with or differs from a Tg of a cured product of the encapsulation resin composition by 20° C. or smaller, 2) a total of a linear expansion coefficient of the cured product of the underfill composition at a temperature not higher than (Tg-30)° C. and a linear expansion coefficient of the cured product of the encapsulation resin composition at a temperature not higher than (Tg-30)° C. is 42 ppm/° C. or smaller, and 3) a ratio of the linear expansion coefficient of the cured product of the encapsulation resin composition to the linear expansion coefficient of the cured product of the underfill composition ranges from 0.3 to 1.0.

摘要翻译： 一种用于制备包装型半导体器件的组合物，其特征在于，所述组合物由用于制备底部填充部分的底部填充组合物和用于制备树脂封装部分的封装树脂组合物组成，其中1）固化 底部填充剂组合物的产物的玻璃化转变温度Tg为100℃以上，与密封树脂组合物的固化物的Tg相同或不同，为20℃以下，2） 在不高于（Tg-30）℃的温度下，底部填充剂组合物的固化产物的线性膨胀系数和包封树脂组合物的固化产物的线膨胀系数在不高于 Tg-30）℃为42ppm /℃以下，3）封装树脂组合物的固化物的线膨胀系数与固化p的线膨胀系数的比 底部填充剂组合物的产率为0.3至1.0。

公开(公告)号：US20070104959A1

公开(公告)日：2007-05-10

申请号：US11590801

申请日：2006-11-01

申请人： Masatoshi Asano ,  Kaoru Katoh ,  Kazuaki Sumita

发明人： Masatoshi Asano ,  Kaoru Katoh ,  Kazuaki Sumita

IPC分类号： B32B27/38 ,  H01L21/56 ,  C08L63/00 ,  B32B37/00

CPC分类号： H01L23/293 ,  C08G59/226 ,  C08G59/38 ,  C08G59/686 ,  C08L63/00 ,  H01L21/563 ,  H01L24/81 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/0105 ,  H01L2924/01077 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/181 ,  Y10T428/31511 ,  H01L2924/00

摘要： A liquid epoxy resin composition comprising (A) a liquid epoxy resin (B) an amine curing agent (C) a nitrogen compound selected from the group consisting of organic acids salts of tertiary amines, amino acids, imino acids, and monoamine compounds having an alcoholic hydroxyl group in an amount of from 0.1 to 20 parts by weight per total 100 parts by weight of the components (A) and (B), and (D) an inorganic filler in an amount of from 50 to 900 parts by weight per 100 parts by weight of the component (A).

摘要翻译： 一种液体环氧树脂组合物，其包含（A）液体环氧树脂（B）胺固化剂（C），选自叔胺的有机酸盐，氨基酸，亚氨基酸和具有 醇羟基的量为0.1〜20重量份，相对于100重量份组分（A）和（B）为100重量份，（D）无机填料的量为50〜900重量份/ 100重量份组分（A）。

公开(公告)号：US06780674B2

公开(公告)日：2004-08-24

申请号：US10327145

申请日：2002-12-24

申请人： Kazuaki Sumita ,  Haruyoshi Kuwabara ,  Toshio Shiobara

发明人： Kazuaki Sumita ,  Haruyoshi Kuwabara ,  Toshio Shiobara

IPC分类号： H01L2158

CPC分类号： C08L63/00 ,  C08G59/226 ,  C08G59/38 ,  H01L23/293 ,  H01L2224/73204 ,  H01L2924/12044 ,  Y10T428/31511 ,  Y10T428/31515

摘要： In a liquid epoxy resin composition comprising a liquid epoxy resin, a curing agent, a curing accelerator, and an inorganic filler, the liquid epoxy resin is a mixture of (a) a liquid epoxy resin containing two or less epoxy functional groups and (b) a solid epoxy resin containing two or more epoxy functional groups in a weight ratio (a)/(b) of from 9/1 to 1/4, having a viscosity of up to 10,000 poises at 25° C. as measured by an E type viscometer. The composition is adherent to silicon chips, the cured product is highly resistant to humidity and thermal shocks, and the composition is useful as sealant for semiconductor devices.

摘要翻译： 在包含液体环氧树脂，固化剂，固化促进剂和无机填料的液体环氧树脂组合物中，液体环氧树脂是（a）含有两个或更少环氧官能团的液体环氧树脂和（b ）含有重量比（a）/（b）为9/1至1/4的两个或多个环氧官能团的固体环氧树脂，其在25℃下的粘度高达10,000泊，如 E型粘度计。 该组合物粘附到硅片上，固化产品对湿度和热冲击具有高度的耐受性，并且该组合物可用作半导体器件的密封剂。

公开(公告)号：US06558812B2

公开(公告)日：2003-05-06

申请号：US09955930

申请日：2001-09-20

申请人： Kazuaki Sumita ,  Toshio Shiobara

发明人： Kazuaki Sumita ,  Toshio Shiobara

IPC分类号： H01L2912

CPC分类号： C08G59/4284 ,  C08G59/4215 ,  C08G59/58 ,  H01L21/563 ,  H01L23/293 ,  H01L24/31 ,  H01L2224/16225 ,  H01L2224/73203 ,  H01L2224/83951 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/12044 ,  Y10T428/12528 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/0401

摘要： A liquid epoxy resin composition comprising (A) a liquid epoxy resin, (B) a curing agent, (C) a curing accelerator, and (D) an inorganic filler is provided, the curing agent (B) comprising 5 to 75 parts by weight of a mixture of 3,4-dimethyl-6-(2-methyl-1-propenyl)-1,2,3,6-tetrahydrophthalic acid and 1-isopropyl-4-methyl-bicyclo[2.2.2]oct-5-ene-2,3-dicarboxylic acid per 100 parts by weight of the entire curing agent. The composition is adherent to the surface of silicon chips, and especially to polyimide resins and nitride films and has high thermal shock resistance. A semiconductor device sealed with the cured epoxy resin composition remains reliable.

公开(公告)号：US06479167B2

公开(公告)日：2002-11-12

申请号：US09774581

申请日：2001-02-01

申请人： Kazuaki Sumita ,  Toshio Shiobara

发明人： Kazuaki Sumita ,  Toshio Shiobara

IPC分类号： H01L2912

CPC分类号： H01L21/563 ,  C08G59/188 ,  C08G59/68 ,  H01L23/293 ,  H01L24/31 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83951 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/181 ,  Y10T428/12528 ,  H01L2924/00 ,  H01L2924/3512

摘要： A sealing material for flip chip-type semiconductor devices comprises a liquid epoxy resin composition which includes (A) a liquid epoxy resin, (B) an optional curing agent, (C) an inorganic filler, and (D) 1 to 15 parts by weight of a microencapsulated catalyst per 100 parts by weight of components A and B combined. The excellent thin-film penetration and shelf stability of the sealing material confer a very high reliability to flip chip-type semiconductor devices made using the sealing material.

摘要翻译： 用于倒装芯片型半导体器件的密封材料包括液体环氧树脂组合物，其包含（A）液体环氧树脂，（B）任选的固化剂，（C）无机填料，和（D）1至15份 每100重量份组分A和B组合的微胶囊化催化剂的重量。 密封材料的优异的薄膜渗透性和储存稳定性使得使用密封材料制造的倒装芯片型半导体器件具有非常高的可靠性。

公开(公告)号：US06225704B1

公开(公告)日：2001-05-01

申请号：US09499022

申请日：2000-02-07

申请人： Kazuaki Sumita ,  Kimitaka Kumagae ,  Miyuki Wakao ,  Toshio Shiobara

发明人： Kazuaki Sumita ,  Kimitaka Kumagae ,  Miyuki Wakao ,  Toshio Shiobara

IPC分类号： H01L2329

CPC分类号： H01L21/563 ,  H01L23/3185 ,  H01L24/31 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83951 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01037 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/00 ,  H01L2924/3512

摘要： A flip-chip type semiconductor device has a semiconductor chip mounted on a substrate via a plurality of bumps. The gap between the substrate and the chip is filled with an underfill material and sealed along sides thereof with a fillet material. The underfill material is a cured epoxy resin composition comprising a liquid epoxy resin and an inorganic filler, having a coefficient of expansion of 20-40 ppm/° C. below its Tg. The fillet material is a similar cured epoxy resin composition having a coefficient of expansion of less than 20 ppm/° C. below its Tg. The device is highly reliable.

摘要翻译： 倒装芯片型半导体器件具有通过多个凸块安装在基板上的半导体芯片。 衬底和芯片之间的间隙填充有底部填充材料，并用圆角材料沿侧面密封。 底部填充材料是包含液体环氧树脂和无机填料的固化环氧树脂组合物，其膨胀系数在其Tg以下为20-40ppm /℃。 圆角材料是类似的固化环氧树脂组合物，其膨胀系数低于Tg的20ppm /℃。 该设备高度可靠。

公开(公告)号：US08828806B2

公开(公告)日：2014-09-09

申请号：US12789996

申请日：2010-05-28

申请人： Kazuaki Sumita

发明人： Kazuaki Sumita

IPC分类号： H01L21/00 ,  C08G59/50 ,  C08K3/00 ,  C08L63/00 ,  H01L23/29 ,  H01L21/56 ,  C08K9/06 ,  C08K5/00 ,  C08K5/1515 ,  C08K5/5435

CPC分类号： H01L21/563 ,  C08G59/5033 ,  C08K3/013 ,  C08K5/0025 ,  C08K5/1515 ,  C08K5/5435 ,  C08K9/06 ,  C08L63/00 ,  H01L23/295 ,  H01L2224/16145 ,  H01L2224/26175 ,  H01L2224/32145 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/10253 ,  H01L2924/12044 ,  C08K3/0033 ,  H01L2924/00 ,  H01L2224/0401

摘要： A composition comprising (A) an epoxy resin, (B) a curing agent, (C) an inorganic filler having an average particle size of 0.1-10 μm and a maximum particle size of up to 75 μm, and (D) a surface-silylated silica having an average particle size of 0.005 μm to less than 0.1 μm is suited as a dam composition for use with a underfill material in the fabrication of multilayer semiconductor packages.

摘要翻译： 一种组合物，其包含（A）环氧树脂，（B）固化剂，（C）平均粒径为0.1-10μm，最大粒径达75μm的无机填料，（D）表面 平均粒径为0.005μm以上且小于0.1μm的硅烷化二氧化硅适合作为用于制造多层半导体封装中的底部填充材料的阻挡组合物。

公开(公告)号：US20100016474A1

公开(公告)日：2010-01-21

申请号：US12499578

申请日：2009-07-08

申请人： Masatoshi ASANO ,  Kaoru Katoh ,  Kazuaki Sumita

发明人： Masatoshi ASANO ,  Kaoru Katoh ,  Kazuaki Sumita

IPC分类号： C08L63/00

CPC分类号： H01L21/563 ,  C08G59/38 ,  C08G59/50 ,  C08K3/36 ,  C08L63/00 ,  H01L23/293 ,  H01L24/81 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/0105 ,  H01L2924/01077 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/181 ,  Y10T428/31511 ,  H01L2924/00

摘要： A liquid epoxy resin composition comprising (A) a liquid epoxy resin, (B) an amine curing agent, and (C) an inorganic filler in an amount of from 50 to 900 parts by weight per 100 parts by weight of the component (A), wherein the component (B) is contained in such an amount that a molar ratio of epoxy groups of the component (A) to amino groups of the component (B), ranges from 0.6 to less than 1.0, provided that, if the component (B) includes an amine curing agent which is solid in the composition at a temperature of from room temperature to 150° C., a content of such an amine is 30 mol % or less, based on the component (B).

摘要翻译： 一种液体环氧树脂组合物，其包含（A）液态环氧树脂，（B）胺固化剂和（C）无机填料，其量为每100重量份组分（A ），其中组分（B）的含量使得组分（A）的环氧基与组分（B）的氨基的摩尔比在0.6至小于1.0的范围内，条件是如果 组分（B）包括在组合物中在室温至150℃的温度下为固体的胺固化剂，基于组分（B），胺的含量为30摩尔％以下。