发明申请
- 专利标题： METHOD AND APPARATUS FOR SEMICONDUCTOR PROCESSING
- 专利标题（中）： 半导体加工方法与装置
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申请号： US11929230申请日： 2007-10-30
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公开(公告)号： US20080073031A1公开(公告)日： 2008-03-27
- 发明人: J.B. Price , Jed Keller , Laurence Dulmage , David Cheng
- 申请人： J.B. Price , Jed Keller , Laurence Dulmage , David Cheng
- 主分类号： H01L21/67
- IPC分类号： H01L21/67 ; H01L21/00
摘要：
A method and apparatus for semiconductor processing is disclosed. In one embodiment, a method of transporting a wafer within a cluster tool, comprises placing the wafer into a first segment of a vacuum enclosure, the vacuum enclosure being attached to a processing chamber and a factory interface. The wafer is transported to a second segment of the vacuum enclosure using a vertical transport mechanism, wherein the second segment is above or below the first segment.