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发明申请
US20080073717A1 Semiconductor devices having substrate plug and methods of forming the same 审中-公开
具有基板插头的半导体器件及其形成方法

Semiconductor devices having substrate plug and methods of forming the same
摘要：
A semiconductor device includes a device isolation layer disposed in a substrate and defining an active region, a first gate pattern on the active region, a first insulating layer on the substrate and the first gate pattern, a first body region on the first insulating layer, and a first substrate plug extending from the substrate into the first insulating layer, the first substrate plug penetrating the device isolation layer and contacting the substrate under the device isolation layer.
摘要（中）：

半导体器件包括设置在衬底中并限定有源区的器件隔离层，有源区上的第一栅极图案，衬底上的第一绝缘层和第一栅极图案，第一绝缘层上的第一体区， 以及从所述基板延伸到所述第一绝缘层中的第一基板插塞，所述第一基板插塞穿透所述器件隔离层并且在所述器件隔离层下面接触所述基板。

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