发明申请
US20080076209A1 METHOD FOR PRODUCING FLEXIBLE INTEGRATED CIRCUITS WHICH MAY BE PROVIDED CONTIGUOUSLY
审中-公开
生产可以连续提供的柔性集成电路的方法
- 专利标题： METHOD FOR PRODUCING FLEXIBLE INTEGRATED CIRCUITS WHICH MAY BE PROVIDED CONTIGUOUSLY
- 专利标题（中）： 生产可以连续提供的柔性集成电路的方法
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申请号： US11850531申请日： 2007-09-05
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公开(公告)号： US20080076209A1公开(公告)日： 2008-03-27
- 发明人: Gerhard KLINK , Christof LANDESBERGER , Michael FEIL
- 申请人： Gerhard KLINK , Christof LANDESBERGER , Michael FEIL
- 申请人地址： US DE Munich
- 专利权人： Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.
- 当前专利权人： Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.
- 当前专利权人地址： US DE Munich
- 优先权： DE102006044525.2-33 20060921
- 主分类号： H01L21/56
- IPC分类号： H01L21/56
摘要：
The present invention provides a method for producing integrated circuits which are mechanically flexible and can be provided contiguously on a common flexible carrier substrate. The method includes a step of continuously providing a first flexible substrate which has conductor-line patterns, and a step of mounting the integrated circuits on the first flexible substrate and connecting the integrated circuits to the conductor-line patterns of the first flexible substrate, and a step of covering the circuits mounted on the first flexible substrate with a second flexible substrate, recesses being provided in the first or second flexible substrates in order to make the conductor-line patterns of the first flexible substrate accessible. The step of covering has the sub-step of continuously providing a flexible film with recesses and laminating same onto the flexible integrated circuits mounted on the first flexible substrate, or a sub-step of applying, by a printing technique, a cover on the flexible integrated circuits mounted on the first flexible substrate.
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