公开(公告)号：US20080232022A1

公开(公告)日：2008-09-25

申请号：US12089972

申请日：2007-03-22

申请人： Christof Landesberger

发明人： Christof Landesberger

IPC分类号： H01L21/683

CPC分类号： H01L21/6833

摘要： Method for handling a substrate with polarizable molecules including providing a carrier with a first junction electrode and disposing the substrate between the first junction electrode and a second junction electrode. Fixing the substrate on the carrier is achieved by applying a voltage between the first junction electrode and the second junction electrode, so that the polarizable molecules are polarized. After removing the second junction electrode, the substrate remains fixed on the carrier.

摘要翻译： 用于处理具有可极化分子的衬底的方法，包括提供具有第一接合电极的载体并将衬底设置在第一接合电极和第二接合电极之间。 通过在第一接合电极和第二接合电极之间施加电压来实现将衬底固定在载体上，使得可极化分子被极化。 在去除第二接合电极之后，衬底保持固定在载体上。

公开(公告)号：US06514790B1

公开(公告)日：2003-02-04

申请号：US09786330

申请日：2001-05-29

申请人： Andreas Plettner ,  Karl Haberger ,  Christof Landesberger

发明人： Andreas Plettner ,  Karl Haberger ,  Christof Landesberger

IPC分类号： H01L2144

CPC分类号： H01L21/67132

摘要： In a method for handling in parallel a plurality of circuit chips, which are arranged in a first arrangement, which corresponds to their arrangement in the original wafer, on the surface of an auxiliary carrier, the plurality of circuit chips is picked up by a plurality of pick up devices. The plurality of pick up devices with the picked up circuit chips is moved simultaneously to one or several carriers, in such a way that, simultaneously with the motion, the first arrangement of the circuit chips is changed into a second arrangement, which is different from the first arrangement. Then the circuit chips are simultaneously placed in the second arrangement on the one or several carriers.

摘要翻译： 在辅助载体的表面上并行处理以与原始晶片中的布置相对应的第一布置的多个电路芯片并行处理的方法，多个电路芯片被多个 的拾起装置。 具有拾取电路芯片的多个拾取装置同时移动到一个或多个载体，使得在运动的同时，将电路芯片的第一布置改变为第二布置，其不同于 第一个安排。 然后将电路芯片同时放置在一个或多个载体上的第二布置中。

公开(公告)号：US08198135B2

公开(公告)日：2012-06-12

申请号：US12943061

申请日：2010-11-10

申请人： Gerhard Klink ,  Christof Landesberger ,  Michael Feil

发明人： Gerhard Klink ,  Christof Landesberger ,  Michael Feil

IPC分类号： H01L21/00 ,  H05K1/16

CPC分类号： H01L23/4985 ,  H01L21/56 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/5389 ,  H01L24/81 ,  H01L24/97 ,  H01L2224/16 ,  H01L2224/2402 ,  H01L2224/76155 ,  H01L2224/81801 ,  H01L2224/82039 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H05K3/005 ,  H05K3/305 ,  H05K3/321 ,  H05K2201/10734 ,  H05K2201/10977 ,  Y10T29/49117 ,  H01L2224/81 ,  H01L2924/00012 ,  H01L2224/0401

摘要： The present invention provides a method for producing integrated circuits which are mechanically flexible and can be provided contiguously on a common flexible carrier substrate. The method includes a step of continuously providing a first flexible substrate which has conductor-line patterns, and a step of mounting the integrated circuits on the first flexible substrate and connecting the integrated circuits to the conductor-line patterns of the first flexible substrate, and a step of covering the circuits mounted on the first flexible substrate with a second flexible substrate, recesses being provided in the first or second flexible substrates in order to make the conductor-line patterns of the first flexible substrate accessible. The step of covering has the sub-step of continuously providing a flexible film with recesses and laminating same onto the flexible integrated circuits mounted on the first flexible substrate, or a sub-step of applying, by a printing technique, a cover on the flexible integrated circuits mounted on the first flexible substrate.

摘要翻译： 本发明提供了一种制造集成电路的方法，所述集成电路机械地是柔性的并且可以连续地设置在共同的柔性载体基板上。 该方法包括连续提供具有导线图案的第一柔性基板的步骤，以及将集成电路安装在第一柔性基板上并将集成电路连接到第一柔性基板的导线图案的步骤，以及 利用第二柔性基板覆盖安装在第一柔性基板上的电路的步骤，在第一柔性基板或第二柔性基板中设置凹槽，以使第一柔性基板的导体线图形可访问。 覆盖步骤具有连续地提供具有凹陷的柔性膜并将其层压到安装在第一柔性基板上的柔性集成电路上的子步骤，或者通过印刷技术将柔性涂覆在柔性基板上的盖子的子步骤 集成电路安装在第一柔性基板上。

公开(公告)号：US20110047793A1

公开(公告)日：2011-03-03

申请号：US12943061

申请日：2010-11-10

申请人： Gerhard KLINK ,  Christof LANDESBERGER ,  Michael FEIL

发明人： Gerhard KLINK ,  Christof LANDESBERGER ,  Michael FEIL

IPC分类号： H01R43/00

CPC分类号： H01L23/4985 ,  H01L21/56 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/5389 ,  H01L24/81 ,  H01L24/97 ,  H01L2224/16 ,  H01L2224/2402 ,  H01L2224/76155 ,  H01L2224/81801 ,  H01L2224/82039 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H05K3/005 ,  H05K3/305 ,  H05K3/321 ,  H05K2201/10734 ,  H05K2201/10977 ,  Y10T29/49117 ,  H01L2224/81 ,  H01L2924/00012 ,  H01L2224/0401

摘要： The present invention provides a method for producing integrated circuits which are mechanically flexible and can be provided contiguously on a common flexible carrier substrate. The method includes a step of continuously providing a first flexible substrate which has conductor-line patterns, and a step of mounting the integrated circuits on the first flexible substrate and connecting the integrated circuits to the conductor-line patterns of the first flexible substrate, and a step of covering the circuits mounted on the first flexible substrate with a second flexible substrate, recesses being provided in the first or second flexible substrates in order to make the conductor-line patterns of the first flexible substrate accessible. The step of covering has the sub-step of continuously providing a flexible film with recesses and laminating same onto the flexible integrated circuits mounted on the first flexible substrate, or a sub-step of applying, by a printing technique, a cover on the flexible integrated circuits mounted on the first flexible substrate.

摘要翻译： 本发明提供了一种制造集成电路的方法，所述集成电路机械地是柔性的并且可以连续地设置在共同的柔性载体基板上。 该方法包括连续提供具有导线图案的第一柔性基板的步骤，以及将集成电路安装在第一柔性基板上并将集成电路连接到第一柔性基板的导线图案的步骤，以及 利用第二柔性基板覆盖安装在第一柔性基板上的电路的步骤，在第一柔性基板或第二柔性基板中设置凹槽，以使第一柔性基板的导体线图形可访问。 覆盖步骤具有连续地提供具有凹陷的柔性膜并将其层压到安装在第一柔性基板上的柔性集成电路上的子步骤，或者通过印刷技术将柔性涂覆在柔性基板上的盖子的子步骤 集成电路安装在第一柔性基板上。

公开(公告)号：US20120091594A1

公开(公告)日：2012-04-19

申请号：US13275988

申请日：2011-10-18

申请人： Christof LANDESBERGER ,  Robert FAUL

发明人： Christof LANDESBERGER ,  Robert FAUL

IPC分类号： H01L23/498 ,  H01L21/78

CPC分类号： H01L24/19 ,  H01L23/3121 ,  H01L23/4985 ,  H01L23/5389 ,  H01L23/552 ,  H01L23/564 ,  H01L24/13 ,  H01L24/20 ,  H01L24/27 ,  H01L24/83 ,  H01L2224/04105 ,  H01L2224/06181 ,  H01L2224/12105 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/21 ,  H01L2224/2101 ,  H01L2224/211 ,  H01L2224/2731 ,  H01L2224/27318 ,  H01L2224/2732 ,  H01L2224/27436 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73267 ,  H01L2224/83132 ,  H01L2224/83143 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/8385 ,  H01L2224/83851 ,  H01L2224/92244 ,  H01L2924/0001 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15321 ,  H05K1/185 ,  H05K2201/10674 ,  H01L2924/00 ,  H01L2924/01014 ,  H01L2924/00014 ,  H01L2224/13099

摘要： A method of producing a chip package includes providing a substrate comprising a first recess having a recess bottom and recess side walls. A chip comprising a chip backside is introduced into the recess such that the chip does not protrude from the recess and such that a gap remains between the recess side walls and the chip, the chip backside being attached to the recess bottom. The gap is filled with a filler material.

摘要翻译： 制造芯片封装的方法包括提供包括具有凹陷底部和凹陷侧壁的第一凹部的基板。 包括芯片背面的芯片被引入到凹部中，使得芯片不从凹部突出，并且在凹部侧壁和芯片之间留有间隙，芯片背面附接到凹部底部。 间隙填充有填料。

公开(公告)号：US07733624B2

公开(公告)日：2010-06-08

申请号：US12089972

申请日：2007-03-22

申请人： Christof Landesberger

发明人： Christof Landesberger

IPC分类号： H01T23/0012

CPC分类号： H01L21/6833

摘要： Method for handling a substrate with polarizable molecules including providing a carrier with a first junction electrode and disposing the substrate between the first junction electrode and a second junction electrode. Fixing the substrate on the carrier is achieved by applying a voltage between the first junction electrode and the second junction electrode, so that the polarizable molecules are polarized. After removing the second junction electrode, the substrate remains fixed on the carrier.

摘要翻译： 用于处理具有可极化分子的衬底的方法，包括提供具有第一接合电极的载体并将衬底设置在第一接合电极和第二接合电极之间。 通过在第一接合电极和第二接合电极之间施加电压来实现将衬底固定在载体上，使得可极化分子被极化。 在去除第二接合电极之后，衬底保持固定在载体上。

公开(公告)号：US07027283B2

公开(公告)日：2006-04-11

申请号：US10343688

申请日：2001-07-30

申请人： Christof Landesberger ,  Armin Klumpp ,  Martin Bleier

发明人： Christof Landesberger ,  Armin Klumpp ,  Martin Bleier

IPC分类号： H01T23/00

CPC分类号： H01L21/6831 ,  H01L21/6833

摘要： The present invention provides a mobile holder for a wafer, which comprises a base element, a first fixing means and a second fixing means. The first fixing means is configured to allow a wafer to be fixed to the base element. The second fixing means is configured to fix the mobile holder to a support for said mobile holder.

摘要翻译： 本发明提供了一种用于晶片的移动支架，其包括基座元件，第一固定装置和第二固定装置。 第一固定装置构造成允许晶片固定到基体元件。 第二固定装置被配置成将移动支架固定到所述移动支架的支撑件上。

公开(公告)号：US08563358B2

公开(公告)日：2013-10-22

申请号：US13275988

申请日：2011-10-18

申请人： Christof Landesberger ,  Robert Faul

发明人： Christof Landesberger ,  Robert Faul

IPC分类号： H01L21/00 ,  H01L23/52

CPC分类号： H01L24/19 ,  H01L23/3121 ,  H01L23/4985 ,  H01L23/5389 ,  H01L23/552 ,  H01L23/564 ,  H01L24/13 ,  H01L24/20 ,  H01L24/27 ,  H01L24/83 ,  H01L2224/04105 ,  H01L2224/06181 ,  H01L2224/12105 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/21 ,  H01L2224/2101 ,  H01L2224/211 ,  H01L2224/2731 ,  H01L2224/27318 ,  H01L2224/2732 ,  H01L2224/27436 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73267 ,  H01L2224/83132 ,  H01L2224/83143 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/8385 ,  H01L2224/83851 ,  H01L2224/92244 ,  H01L2924/0001 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15321 ,  H05K1/185 ,  H05K2201/10674 ,  H01L2924/00 ,  H01L2924/01014 ,  H01L2924/00014 ,  H01L2224/13099

摘要： A method of producing a chip package includes providing a substrate comprising a first recess having a recess bottom and recess side walls. A chip comprising a chip backside is introduced into the recess such that the chip does not protrude from the recess and such that a gap remains between the recess side walls and the chip, the chip backside being attached to the recess bottom. The gap is filled with a filler material.

摘要翻译： 制造芯片封装的方法包括提供包括具有凹陷底部和凹陷侧壁的第一凹部的基板。 包括芯片背面的芯片被引入到凹部中，使得芯片不从凹部突出，并且在凹部侧壁和芯片之间留有间隙，芯片背面附接到凹部底部。 间隙填充有填料。

公开(公告)号：US20080076209A1

公开(公告)日：2008-03-27

申请号：US11850531

申请日：2007-09-05

申请人： Gerhard KLINK ,  Christof LANDESBERGER ,  Michael FEIL

发明人： Gerhard KLINK ,  Christof LANDESBERGER ,  Michael FEIL

IPC分类号： H01L21/56

CPC分类号： H01L23/4985 ,  H01L21/56 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/5389 ,  H01L24/81 ,  H01L24/97 ,  H01L2224/16 ,  H01L2224/2402 ,  H01L2224/76155 ,  H01L2224/81801 ,  H01L2224/82039 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H05K3/005 ,  H05K3/305 ,  H05K3/321 ,  H05K2201/10734 ,  H05K2201/10977 ,  Y10T29/49117 ,  H01L2224/81 ,  H01L2924/00012 ,  H01L2224/0401

摘要： The present invention provides a method for producing integrated circuits which are mechanically flexible and can be provided contiguously on a common flexible carrier substrate. The method includes a step of continuously providing a first flexible substrate which has conductor-line patterns, and a step of mounting the integrated circuits on the first flexible substrate and connecting the integrated circuits to the conductor-line patterns of the first flexible substrate, and a step of covering the circuits mounted on the first flexible substrate with a second flexible substrate, recesses being provided in the first or second flexible substrates in order to make the conductor-line patterns of the first flexible substrate accessible. The step of covering has the sub-step of continuously providing a flexible film with recesses and laminating same onto the flexible integrated circuits mounted on the first flexible substrate, or a sub-step of applying, by a printing technique, a cover on the flexible integrated circuits mounted on the first flexible substrate.

摘要翻译： 本发明提供了一种制造集成电路的方法，所述集成电路机械地是柔性的并且可以连续地设置在共同的柔性载体基板上。 该方法包括连续提供具有导线图案的第一柔性基板的步骤，以及将集成电路安装在第一柔性基板上并将集成电路连接到第一柔性基板的导线图案的步骤，以及 利用第二柔性基板覆盖安装在第一柔性基板上的电路的步骤，在第一柔性基板或第二柔性基板中设置凹槽，以使第一柔性基板的导体线图形可访问。 覆盖步骤具有连续地提供具有凹陷的柔性膜并将其层压到安装在第一柔性基板上的柔性集成电路上的子步骤，或者通过印刷技术将柔性涂覆在柔性基板上的盖子的子步骤 集成电路安装在第一柔性基板上。

公开(公告)号：US06328841B1

公开(公告)日：2001-12-11

申请号：US09269391

申请日：1999-11-05

申请人： Armin Klumpp ,  Christof Landesberger

发明人： Armin Klumpp ,  Christof Landesberger

IPC分类号： B32B3112

CPC分类号： H01L21/2007

摘要： In a method of connecting a first and a second silicon wafer, the first silicon wafer is first provided with a polyimide layer on a main surface thereof. Subsequently, a plasma-induced reaction between the polyimide layer and water is performed. A plasma-induced reaction is also performed between a main surface of the second silicon wafer and chlorine. The main surface of the second silicon wafer is then subjected to a treatment with hydrolyzed triethoxysilylpropanamine. Following this, the surfaces of the two silicon wafers, which have been subjected to the plasma-induced reactions, are joined together so as connect the silicon wafers permanently.

摘要翻译： 在连接第一和第二硅晶片的方法中，第一硅晶片首先在其主表面上设置有聚酰亚胺层。 随后，进行聚酰亚胺层和水之间的等离子体诱导反应。 还在第二硅晶片的主表面和氯之间进行等离子体诱导反应。 然后将第二硅晶片的主表面用水解的三乙氧基甲硅烷基丙胺进行处理。 接下来，已经经受等离子体诱导反应的两个硅晶片的表面被连接在一起，以便永久地连接硅晶片。