发明申请
US20080079455A1 IC Chip Package, Test Equipment and Interface for Performing a Functional Test of a Chip Contained Within Said Chip Package
审中-公开
IC芯片封装，用于执行所述芯片封装内包含的芯片的功能测试的测试设备和接口
- 专利标题： IC Chip Package, Test Equipment and Interface for Performing a Functional Test of a Chip Contained Within Said Chip Package
- 专利标题（中）： IC芯片封装，用于执行所述芯片封装内包含的芯片的功能测试的测试设备和接口
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申请号： US11866677申请日： 2007-10-03
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公开(公告)号： US20080079455A1公开(公告)日： 2008-04-03
- 发明人: Joerg Vollrath , Marcin Gnat , Ralf Schneider
- 申请人： Joerg Vollrath , Marcin Gnat , Ralf Schneider
- 主分类号： G01R31/26
- IPC分类号： G01R31/26
摘要：
An interface between a test access port of an integrated circuit chip and a test equipment, which is designed to perform a functional test of the chip, is provided. The interface includes electric pads on either sides of the chip and the test equipment. The pads are arranged to interact by means of capacitive coupling, when a test data signal is input to one of the pads. Preferably, both pads are connected with either a receiver or a driver depending on the direction of the data flow. The electric pads relating to the chip's side may be arranged within the wiring substrate of a chip package, particularly along edge portion of the substrate, which encompasses an inner portion of the substrate, in which a ball-grid-array can be formed.
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