发明申请
- 专利标题： METHOD AND APPARATUS FOR REAL-TIME MEASUREMENT OF TRACE METAL CONCENTRATION IN CHEMICAL MECHANICAL POLISHING (CMP) SLURRY
- 专利标题（中）： 在化学机械抛光（CMP）浆料中实时测量金属浓度的方法和装置
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申请号： US11936863申请日： 2007-11-08
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公开(公告)号： US20080080669A1公开(公告)日： 2008-04-03
- 发明人: Theodore van Kessel
- 申请人： Theodore van Kessel
- 申请人地址： US NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： US NY Armonk
- 主分类号： G01N23/223
- IPC分类号： G01N23/223
摘要：
A system (and method) for real-time measurement of trace metal concentration in a chemical mechanical polishing (CMP) slurry, includes an electromagnetic radiation flow cell carrying a CMP slurry, a slurry pickup head coupled to the flow cell, and an analyzer for measuring properties of the slurry flowing through the flow cell.
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