Invention Application
US20080083995A1 EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR DEVICE AND THIN SEMICONDUCTOR DEVICE
审中-公开
用于封装半导体器件和半导体器件的环氧树脂组合物
- Patent Title: EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR DEVICE AND THIN SEMICONDUCTOR DEVICE
- Patent Title (中): 用于封装半导体器件和半导体器件的环氧树脂组合物
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Application No.: US11866780Application Date: 2007-10-03
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Publication No.: US20080083995A1Publication Date: 2008-04-10
- Inventor: Shoichi OSADA
- Applicant: Shoichi OSADA
- Applicant Address: JP Chiyoda-ku
- Assignee: Shin-Etsu Chemical Co., Ltd.
- Current Assignee: Shin-Etsu Chemical Co., Ltd.
- Current Assignee Address: JP Chiyoda-ku
- Priority: JP2006-273061 20061004
- Main IPC: H01L23/29
- IPC: H01L23/29 ; C08L63/00
Abstract:
An epoxy resin composition for encapsulating a semiconductor device is provided. This composition contains the following components (A), (C), (D), (E), (F) and (G) as critical components: (A) an epoxy resin; (C) an inorganic filler; (D) a curing accelerator of the general formula (1): (E) a radical initiator; (F) a compound having at least two maleimide group per molecule; and (G) a phenol compound having at least one alkenyl group per molecule.
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