发明申请
- 专利标题： LASER PROCESSING APPARATUS, LASER PROCESSING METHOD, MANUFACTURING METHOD OF WIRING SUBSTRATE, MANUFACTURING METHOD OF DISPLAY APPARATUS AND WIRING SUBSTRATE
- 专利标题（中）： 激光加工装置，激光加工方法，接线基板的制造方法，显示装置和布线基板的制造方法
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申请号： US11860199申请日： 2007-09-24
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公开(公告)号： US20080085413A1公开(公告)日： 2008-04-10
- 发明人: Kazuhito Shimoda , Ryo Koshiishi , Satoshi Tomioka , Hideo Kawabe
- 申请人： Kazuhito Shimoda , Ryo Koshiishi , Satoshi Tomioka , Hideo Kawabe
- 申请人地址： JP Tokyo 108-0075
- 专利权人： SONY CORPORATION
- 当前专利权人： SONY CORPORATION
- 当前专利权人地址： JP Tokyo 108-0075
- 优先权： JPP2006-275322 20061006; JPP2005-002585 20070110
- 主分类号： C23C14/28
- IPC分类号： C23C14/28 ; B32B17/10
摘要：
A laser processing apparatus includes a support table, a local exhaust device, and a laser light source unit. The support table supports a processing object. The local exhaust device directs laser light into a local exhaust unit in which pressure is locally adjusted over the support table. The laser light source unit outputs the laser light. The local exhaust device is capable of relatively being lifted from the support table by injecting a lift gas to the support table. The processing object includes a multilayer film formed of two or more layers with different materials. An input unit into which reflectance of the processing object is inputted is connected to the laser light source unit.
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