Invention Application
- Patent Title: Method and apparatus for processing a wafer
- Patent Title (中): 用于处理晶片的方法和装置
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Application No.: US11977833Application Date: 2007-10-26
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Publication No.: US20080085477A1Publication Date: 2008-04-10
- Inventor: Steven Verhaverbeke , J. Truman , Christopher Lane , Sasson Somekh
- Applicant: Steven Verhaverbeke , J. Truman , Christopher Lane , Sasson Somekh
- Main IPC: G03F1/10
- IPC: G03F1/10
Abstract:
A method of a single wafer wet/dry cleaning apparatus comprising: a transfer chamber having a wafer handler contained therein; a first single wafer wet cleaning chamber directly coupled to the transfer chamber; and a first single wafer ashing chamber directly coupled to the transfer chamber.
Information query
