发明申请
- 专利标题： CAMERA MODULE AND METHOD OF FABRICATING THE SAME
- 专利标题（中）： 相机模块及其制作方法
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申请号： US11866940申请日： 2007-10-03
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公开(公告)号： US20080087974A1公开(公告)日： 2008-04-17
- 发明人: Yong-Chai KWON , Dong-Ho LEE
- 申请人： Yong-Chai KWON , Dong-Ho LEE
- 申请人地址： KR Gyeonggi-do
- 专利权人： SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人： SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人地址： KR Gyeonggi-do
- 优先权： KR10-2006-0097471 20061003
- 主分类号： H01L31/0232
- IPC分类号： H01L31/0232 ; H01L31/18
摘要：
Provided are a camera module and a method of fabricating the same. The method includes preparing a lens structure including upper connection portions. Lower connection portions are formed in a predetermined region of a substrate. The lower connection portions define a chip region and fit in the upper connection portions, respectively. An image sensor chip is located on the bottom surface of the chip region. The lens structure is adhered to the substrate using the upper and lower connection portions.