发明申请
- 专利标题： SEMICONDUCTOR PACKAGE PREVENTING GENERATION OF STATIC ELECTRICITY THEREIN
- 专利标题（中）： 半导体封装防止静电产生
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申请号： US11870533申请日： 2007-10-11
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公开(公告)号： US20080087988A1公开(公告)日： 2008-04-17
- 发明人: Hee-seok Lee , Yun-seok Choi , Eun-seok Song
- 申请人： Hee-seok Lee , Yun-seok Choi , Eun-seok Song
- 优先权： KR10-2006-0098865 20061011
- 主分类号： H01L23/552
- IPC分类号： H01L23/552
摘要：
A semiconductor package includes a chip including a conductive pattern thereon, a conductive network attached on a surface of the chip to absorb static electricity, at least one conductive rod attached to the conductive network, wherein the at least one conductive rod is formed substantially perpendicularly to the conductive network, and a grounding portion discharging the static electricity absorbed from the conductive network.