Invention Application
- Patent Title: ELECTRONIC DEVICE WITH INTEGRATED MICROMECHANICAL CONTACTS AND COOLING SYSTEM
- Patent Title (中): 具有集成微机械接触和冷却系统的电子设备
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Application No.: US11548668Application Date: 2006-10-11
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Publication No.: US20080088010A1Publication Date: 2008-04-17
- Inventor: Eric D. Hobbs , Gaetan Mathieu
- Applicant: Eric D. Hobbs , Gaetan Mathieu
- Assignee: FormFactor, Inc.
- Current Assignee: FormFactor, Inc.
- Main IPC: H01L23/34
- IPC: H01L23/34
Abstract:
An electronic device can comprise a semiconductor die on which can be formed a micromechanical system. The micromechanical system can comprise a plurality of electrically conductive elongate, contact structures, which can be disposed on input and/or output terminals of the semiconductor die. The micromechanical system can also comprise a cooling structure disposed on the semiconductor die.
Public/Granted literature
- US07999375B2 Electronic device with integrated micromechanical contacts and cooling system Public/Granted day:2011-08-16
Information query
IPC分类:
